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  70204-0343 Datasheet PDF File

For 70204-0343 Found Datasheets File :: 110+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 |   

    0025021012 25-02-1012 SDA-70204-0325

Molex Electronics Ltd.
Part No. 0025021012 25-02-1012 SDA-70204-0325
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 222.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 10106267-0204006LF
Description PwrBlade+® , Power Connectors, 1LP+16S+1LP, Vertical, Header.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0025021024 25-02-1024 SDA-70204-0331

Molex Electronics Ltd.
Part No. 0025021024 25-02-1024 SDA-70204-0331
Description 2.54mm (.100

File Size 222.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 380-3436-200
Description Receptacle MOD,INFINX 4 Pair,15 Position,9MM, 85MΩ, w/lossy
Tech specs    

Official Product Page

    70204-0341 SDA-70204-0341 0025021044 25-02-1044

Molex Electronics Ltd.
Part No. 70204-0341 SDA-70204-0341 0025021044 25-02-1044
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 44 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 221.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 86503-430HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    0025022014 SDA-70204-0390 25-02-2014

Molex Electronics Ltd.
Part No. 0025022014 SDA-70204-0390 25-02-2014
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 14 Circuits, Tn (Sn) Plating
2.54mm (.100") Pitch C-Grid垄莽 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 14 Circuits, Tn (Sn) Plating

File Size 223.42K  /  3 Page

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Amphenol Communications Solutions

Part No. 86130343130345E1LF
Description 8613 F LF CNR
Tech specs    

Official Product Page

    0025026040 25-02-6040 SDA-70204-0275

Molex Electronics Ltd.
Part No. 0025026040 25-02-6040 SDA-70204-0275
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 40 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 236.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 86503-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    25-02-1030 0025021030 SDA-70204-0334

Molex Electronics Ltd.
Part No. 25-02-1030 0025021030 SDA-70204-0334
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 222.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 86503-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    TA75074 TA75074F TA75074P E003434

Toshiba, Corp.
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TA75074 TA75074F TA75074P E003434
Description QUAD OPERTIONAL AMPLIFIER OPERTIONAL放大
From old datasheet system

File Size 255.32K  /  7 Page

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Amphenol Communications Solutions

Part No. 86503-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    TA75071P TA75071S TA75071 E003432

Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TA75071P TA75071S TA75071 E003432
Description SINGLE OPERTIONAL AMPLIFIER
SINGLE OPERTIONAL AMPLOIFIER
From old datasheet system

File Size 253.60K  /  7 Page

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Amphenol Communications Solutions

Part No. 86130343130385E1LF
Description 8613 F LF CNR
Tech specs    

Official Product Page

   
Part No. 15324983 12034365
Description
File Size 189.89K  /  1 Page

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Amphenol Communications Solutions

Part No. G888A103431THR
Description Protect Header 2.54mm Pitch STR DIP, 1x3Pin, MATTE TIN, NY4T, TAIL=2.3mm, W/POST, T&R, CAP, BLACK, HALOGEN FREE
Tech specs    

Official Product Page

    A-70567-0343 15-80-1101 0015801101

Molex Electronics Ltd.
Part No. A-70567-0343 15-80-1101 0015801101
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 86503-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

For 70204-0343 Found Datasheets File :: 110+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 |   

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