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  70287-1011 Datasheet PDF File

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    0702871260

Molex Electronics Ltd.
Part No. 0702871260
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 34 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 303.44K  /  5 Page

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Rochester Electronics LLC

Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0702871266

Molex Electronics Ltd.
Part No. 0702871266
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 46 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 303.44K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0702871264

Molex Electronics Ltd.
Part No. 0702871264
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 42 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 303.44K  /  5 Page

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Amphenol Communications Solutions

Part No. 10118085-101-10LF
Description Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0702871262

Molex Electronics Ltd.
Part No. 0702871262
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 38 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 303.45K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114831-10112LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 12 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0702871261

Molex Electronics Ltd.
Part No. 0702871261
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 36 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 303.44K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114829-10113LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions
Tech specs    

Official Product Page

    0702871215 70287-1215

Molex Electronics Ltd.
Part No. 0702871215 70287-1215
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 42 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
2.54mm (.100") Pitch C-Grid垄莽 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 42 Circuits, 6.10mm (.240") Mating Pin Length, 0.76楼矛m (30楼矛") Gold (Au)

File Size 308.50K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114828-10113LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    0702871216 70287-1216

Molex Electronics Ltd.
Part No. 0702871216 70287-1216
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 44 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
2.54mm (.100") Pitch C-Grid垄莽 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 44 Circuits, 6.10mm (.240") Mating Pin Length, 0.76楼矛m (30楼矛") Gold (Au)

File Size 308.50K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114830-10113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    70287-1024 0702871024

Molex Electronics Ltd.
Part No. 70287-1024 0702871024
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 52 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 52 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.32K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114831-10111LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 11 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    70287-1013 0702871013

Molex Electronics Ltd.
Part No. 70287-1013 0702871013
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 30 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 30 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.31K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114830-10112LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 12 Positions
Tech specs    

Official Product Page

    70287-1014 0702871014

Molex Electronics Ltd.
Part No. 70287-1014 0702871014
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 32 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 32 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.32K  /  6 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 70287-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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