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  70567-0013 Datasheet PDF File

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    70018-0013

Molex Electronics Ltd.
Part No. 70018-0013
Description 2.54mm (.100) Pitch, SL Single Row Wire-to-Wire Panel Mount, 14 Circuits
2.54mm (.100") Pitch, SL Single Row Wire-to-Wire Panel Mount, 14 Circuits
File Size 187.55K  /  3 Page

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Amphenol Communications Solutions
Part No. 10106268-0013101LF
Description PwrBlade+® , Power Connectors, 52S STB, Vertical, Receptacle.
Tech specs 　 　

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HUA FENG CIRCUIT





    A-70567-0346 15-80-1161 0015801161

Molex Electronics Ltd.
Part No. A-70567-0346 15-80-1161 0015801161
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
File Size 1,218.35K  /  7 Page

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Amphenol Communications Solutions
Part No. 20021521-00130C4LF
Description Minitek127®, Shrouded Board to Board Header, Surface Mount, 30 positions, 1.27mm (0.500in) pitch.
Tech specs 　 　

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    A-70567-0358 15-80-1401 0015801401

Molex Electronics Ltd.
Part No. A-70567-0358 15-80-1401 0015801401
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions
Part No. 10082378-10013TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    A-70567-0215 0015800267

Molex Electronics Ltd.
Part No. A-70567-0215 0015800267
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits
File Size 1,218.31K  /  7 Page

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Amphenol Communications Solutions
Part No. U92A110100131
Description MiniSAS HD, High Speed Input Output Connector, 1X1 HD MINISAS CAGE ASSY.
Tech specs 　 　

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    15-80-0069 0015800069 A-70567-0273

Molex Electronics Ltd.
Part No. 15-80-0069 0015800069 A-70567-0273
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.
File Size 1,218.56K  /  7 Page

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Amphenol Communications Solutions
Part No. 10145226-0001311LF
Description DDR4 DIMM, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
Tech specs 　 　

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    15-80-0085 0015800085 A-70567-0138

Molex Electronics Ltd.
Part No. 15-80-0085 0015800085 A-70567-0138
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
File Size 1,218.46K  /  7 Page

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Amphenol Communications Solutions
Part No. 65820-013LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angle Header, Through Hole, Double row , 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    15-80-0087 0015800087 A-70567-0206

Molex Electronics Ltd.
Part No. 15-80-0087 0015800087 A-70567-0206
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
File Size 1,218.48K  /  7 Page

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Amphenol Communications Solutions
Part No. 68000-131HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    A-70567-0348 15-80-1201 0015801201

Molex Electronics Ltd.
Part No. A-70567-0348 15-80-1201 0015801201
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
File Size 1,218.35K  /  7 Page

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Amphenol Communications Solutions
Part No. 10069690-10013TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    15-80-0089 0015800089 A-70567-0274

Molex Electronics Ltd.
Part No. 15-80-0089 0015800089 A-70567-0274
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.
File Size 1,218.52K  /  7 Page

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Amphenol Communications Solutions
Part No. 66900-130LF
Description Quickie Header, Wire to Board Connector, Standard Dual Beam - Double row - 30 Positions - 2.54 mm (0.1 in.) .
Tech specs 　 　

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    0015800209 15-80-0209 A-70567-0280

Molex Electronics Ltd.
Part No. 0015800209 15-80-0209 A-70567-0280
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
File Size 1,218.34K  /  7 Page

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Amphenol Communications Solutions
Part No. 87900-132HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

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