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  73944-7017 Datasheet PDF File

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    73944-5217 0739445217

Molex Electronics Ltd.
Part No. 73944-5217 0739445217
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 153.82K  /  4 Page

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Amphenol Communications Solutions
Part No. 73944-2002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0739441016

Molex Electronics Ltd.
Part No. 0739441016
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 154.07K  /  4 Page

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Amphenol Communications Solutions
Part No. 73944-1003LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Through Hole, 5 Rows, 210 Positions.
Tech specs 　 　

Official Product Page

    0739441217

Molex Electronics Ltd.
Part No. 0739441217
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 154.07K  /  4 Page

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Amphenol Communications Solutions
Part No. 73944-1002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs 　 　

Official Product Page

    73944-1000 0739441000

Molex Electronics Ltd.
Part No. 73944-1000 0739441000
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 154.07K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-444HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    73944-1001 0739441001

Molex Electronics Ltd.
Part No. 73944-1001 0739441001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 154.07K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-448HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    73944-1003 0739441003

Molex Electronics Ltd.
Part No. 73944-1003 0739441003
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderGuide Pin Option, 144 Circuits
File Size 153.82K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-446HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    73944-1201 0739441201

Molex Electronics Ltd.
Part No. 73944-1201 0739441201
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 154.07K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    73944-1200 0739441200

Molex Electronics Ltd.
Part No. 73944-1200 0739441200
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 154.07K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-440HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    0739442216

Molex Electronics Ltd.
Part No. 0739442216
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderGuide Pin Option, 72 Circuits
File Size 153.78K  /  4 Page

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Amphenol Communications Solutions
Part No. 65817-017LF
Description PV® Wire-to-Board Connector System, Mini Latch Housing, Double Row, Bulkhead, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0739440216

Molex Electronics Ltd.
Part No. 0739440216
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits
File Size 154.07K  /  4 Page

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Amphenol Communications Solutions
Part No. 75970-175-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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