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  8043 Datasheet PDF File

For 8043 Found Datasheets File :: 100+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 |   

    WT8043N24 WT8043 WT8043N16 WT8043N20P1 WT8043N20P4 WT8043N20P7 WT8043N20P8

Weltrend Semiconductor
ETC[ETC]
Part No. WT8043N24 WT8043 WT8043N16 WT8043N20P1 WT8043N20P4 WT8043N20P7 WT8043N20P8
Description Synchronous Signal discriminator for Multi-Sync Display Monitor

File Size 82.72K  /  20 Page

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Amphenol Communications Solutions

Part No. 76345-804-30LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 30 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Microsemi
Part No. APT8043SFLLG APT8043BFLLG
Description FREDFETs

File Size 153.28K  /  5 Page

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Amphenol Communications Solutions

Part No. 77319-804-36LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    LTC8043 LTC8043EN8 LTC8043ES8 LTC8043FN8 LT8043 LTC8043FS8

Linear Technology Corporation
Part No. LTC8043 LTC8043EN8 LTC8043ES8 LTC8043FN8 LT8043 LTC8043FS8
Description From old datasheet system
Serial 12-Bit Multiplying DAC in SO-8

File Size 173.97K  /  4 Page

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Amphenol Communications Solutions

Part No. 77317-804-36LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 36 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    DAC8043 DAC8043AZ DAC8043AZ_883 DAC8043EZ DAC8043FP DAC8043FS DAC8043FZ DAC8043GP DAC8043HP

Analog Devices
Part No. DAC8043 DAC8043AZ DAC8043AZ_883 DAC8043EZ DAC8043FP DAC8043FS DAC8043FZ DAC8043GP DAC8043HP
Description 12-Bit Serial Input Multiplying CMOS D/A Converter

File Size 181.45K  /  12 Page

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Amphenol Communications Solutions

Part No. 10121505-480436ALF
Description HPCE Vertical Receptacle 52P 36S with enhanced wall
Tech specs    

Official Product Page

    UPD780001 UPD78P0914 UPD78043F UPD78043FGF-XXX-3B9

NEC
Part No. UPD780001 UPD78P0914 UPD78043F UPD78043FGF-XXX-3B9
Description 8-BIT SINGLE-CHIP MICROCOMPUTER

File Size 335.86K  /  72 Page

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Amphenol Communications Solutions

Part No. 77317-804-32LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 32 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    Air Cost Control
Part No. DAC8043AZ/883C
Description 12-Bit Digital-to-Analog Converter 12位数字到模拟转换

File Size 454.60K  /  8 Page

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Amphenol Communications Solutions

Part No. 77317-804-38LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    K4S280432E K4S280432E-TL75 K4S280432E-TC75 K4S281632E-TL75 K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. K4S280432E K4S280432E-TL75 K4S280432E-TC75 K4S281632E-TL75 K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60
Description 128Mb E-die SDRAM Specification 128Mb的电子芯片内存规

File Size 142.99K  /  14 Page

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Amphenol Communications Solutions

Part No. 77317-804-30LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 30 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    K4S280432F K4S280432F-TC75 K4S280432F-TL75 K4S281632F-TL75 K4S280832F-TC75 K4S280832F-TL75 K4S281632F-TC60 K4S281632F-TC

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. K4S280432F K4S280432F-TC75 K4S280432F-TL75 K4S281632F-TL75 K4S280832F-TC75 K4S280832F-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60
Description RES, 16.9, 1/16W, TKF, 1%, 0603
TV 11C 11#12 PIN RECP
128MB F-DIE SDRAM SPECIFICATION

File Size 140.81K  /  14 Page

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Amphenol Communications Solutions

Part No. 54121-804321000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 32 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K4S281632F-UC75 K4S280432F-UC K4S280832F-UC75 K4S280832F-UL75 K4S281632F-UL75 K4S280432F-UC75 K4S280432F-UL75 K4S281632F

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S281632F-UC75 K4S280432F-UC K4S280832F-UC75 K4S280832F-UL75 K4S281632F-UL75 K4S280432F-UC75 K4S280432F-UL75 K4S281632F-UC60 K4S281632F-UC60_75 K4S281632F-UL60 K4S281632F-UL60_75 K4S281632F-UC60/75 K4S281632F-UL60/75 K4S280432F-UC750 K4S281632F-UL750
Description 8M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
32M X 4 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 128Mb的的F -模与铅SDRAM的规4 TSOP-II免费(符合RoHS
CAP 0.1UF 100V 10% X7R SMD-1206 TR-7-PL 3K/REEL

File Size 142.90K  /  14 Page

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Amphenol Communications Solutions

Part No. 78280-430
Description Quickie® IDC Cable-to-Board Connector System, Shrouded Slim Line Header, Vertical, Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60 K4S281632E-TL75 K4S281632F-TC60 K4S28163

Samsung Electronic
Samsung semiconductor
Part No. K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60 K4S281632E-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 K4S280432E-TC75 K4S280432E-TL75
Description 128Mb F-die SDRAM Specification
128Mb E-die SDRAM Specification

File Size 142.11K  /  14 Page

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Amphenol Communications Solutions

Part No. 77311-804-36LF
Description BERGSTIK
Tech specs    

Official Product Page

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Part: 8042665
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