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  85009-0854 Datasheet PDF File

For 85009-0854 Found Datasheets File :: 111+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 |   

    71308-5454 0713085454

Molex Electronics Ltd.
Part No. 71308-5454 0713085454
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 54 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 54242-108500950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71308-5456 0713085456

Molex Electronics Ltd.
Part No. 71308-5456 0713085456
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 56 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 10085429-11123TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

   
Part No. RJK0854DPB-00-J5
Description 25 A, 80 V, 0.013 ohm, N-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND LEAD FREE, SC-100, LFPAK-4

File Size 139.60K  /  7 Page

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Amphenol Communications Solutions

Part No. 10085429-41223TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0713085462

Molex Electronics Ltd.
Part No. 0713085462
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 62 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10118085-401-12LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded horizontal header, Surface mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch, with peg.
Tech specs    

Official Product Page

    0713085458 71308-5458

Molex Electronics Ltd.
Part No. 0713085458 71308-5458
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 58 Circuits, 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10085429-11223TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    RJK0854DPB-00-J5

Renesas Electronics Corporation
Part No. RJK0854DPB-00-J5
Description 80V, 25A, 13 m max. Silicon N Channel Power MOS FET Power Switching

File Size 130.77K  /  7 Page

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Amphenol Communications Solutions

Part No. 10085429-11113TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0713085416 71308-5416

Molex Electronics Ltd.
Part No. 0713085416 71308-5416
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 10085429-11023TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0713085422

Molex Electronics Ltd.
Part No. 0713085422
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 22 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10118085-401A04LF
Description Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 4 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0713085424

Molex Electronics Ltd.
Part No. 0713085424
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 24 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10085429-11213TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    SDR08540M3-01

TDK Electronics
Part No. SDR08540M3-01
Description Electromagnetic Buzzers

File Size 49.97K  /  4 Page

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