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  90130-3350 Datasheet PDF File

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    FM3300-L FM3350-L FM330-L FM320-AL

Formosa MS
Part No. FM3300-L FM3350-L FM330-L FM320-AL
Description Chip Schottky Barrier Rectifier

File Size 162.72K  /  7 Page

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Texas Instruments

Part No. REG104FA-3.3/500
Description 1A, Low-Noise, Low Dropout Regulator 5-DDPAK/TO-263
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MC33503 MC33501 MC33501-D MC33501.REV5

ON Semiconductor
Part No. MC33503 MC33501 MC33501-D MC33501.REV5
Description From old datasheet system
1.0 V, Rail-to-Rail, SingleOperational Amplifiers

File Size 203.40K  /  16 Page

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Texas Instruments

Part No. REG1117F-3.3/500
Description 1A Low Dropout Positive Regulator 3-DDPAK/TO-263 0 to 125
Tech specs    

Official Product Page

    0901301306 90130-1306

Molex Electronics Ltd.
Part No. 0901301306 90130-1306
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.96K  /  7 Page

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Texas Instruments

Part No. TPS43350QDAPRQ1
Description 40V Dual Synchronous Buck Controller 38-HTSSOP -40 to 125
Tech specs    

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Official Product Page

    0901301308 90130-1308

Molex Electronics Ltd.
Part No. 0901301308 90130-1308
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 8 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.96K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    PM3350-RC PM3350-SW PM3350 1970109

PMC[PMC-Sierra, Inc]
Part No. PM3350-RC PM3350-SW PM3350 1970109
Description From old datasheet system
8-Port 10 Mbit/s Switch
8 PORT ETHERNET SWITCH

File Size 1,002.91K  /  224 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0901301316 90130-1316

Molex Electronics Ltd.
http://
Part No. 0901301316 90130-1316
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.96K  /  7 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901301312 90130-1312

Molex Electronics Ltd.
http://
Part No. 0901301312 90130-1312
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.97K  /  7 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    0901301310 90130-1310

Molex Electronics Ltd.
http://
Part No. 0901301310 90130-1310
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.96K  /  7 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    0901301314 90130-1314

Molex Electronics Ltd.
http://
Part No. 0901301314 90130-1314
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.97K  /  7 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901301340

Molex Electronics Ltd.
Part No. 0901301340
Description
File Size 585.97K  /  7 Page

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