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				SIRENZA[SIRENZA MICRODEVICES]
Part No.	SUF-3000
OCR Text	...Thermal Resistance (junction-to-backside) dB V mA dB/C C/W 2 GHz 6 GHz 14 GHz 2 GHz 6 GHz 14 GHz 2 GHz 6 GHz 14 GHz 2 GHz 6 GHz 14 GHz 2 GHz 6 GHz 14 GHz 2 GHz 6 GHz 14 GHz 2 GHz 6 GHz 14 GHz 10.0 10.0 8.0 16.0 15.5 13.5 27.0 26.5 ...
Description	0.25-16 GHz, Cascadable pHEMT MMIC Amplifier
File Size	132.14K / 4 Page	View it Online	Download Datasheet

				SIRENZA[SIRENZA MICRODEVICES]
Part No.	SUF-2000
OCR Text	...Thermal Resistance (junction-to-backside) mA Typ. C/W V =5V I = 80 S D VS = 3.3V, ID = 71mA OIP3 Tone Spacing = 1MHz, Pout per tone = 0 dBm TL = 25C ZS = ZL = 50 Ohms Measured with Bias Tees ZS = ZL = 50 Ohms. GSG Probe Data With Bias T...
Description	0.2-10 GHz, Cascadable pHEMT MMIC Amplifier
File Size	148.34K / 4 Page	View it Online	Download Datasheet

				SIRENZA[SIRENZA MICRODEVICES]
Part No.	SUF-1000
OCR Text	...Thermal Resistance (junction to backside) C/W 262 VS = 5 V ID = 80 mA Typ. OIP3 Tone Spacing = 1 MHz, Pout per tone = 0 dBm Test Conditions: Test Conditions: VS = 5.0V, Rbias=35 Ohms, ID = 46mA, OIP3 Tone Spacing = 1MHz, Pout per tone = 0 d...
Description	DC-20 GHz, Cascadable pHEMT MMIC Amplifier
File Size	124.94K / 4 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	PB-CMM0014-BD-0000 CMM0014-BD07 CMM0014-BD-000V
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Test Instrumentation, Military, Space, Microwave Point-to-Poi...
Description	2.0-22.0 GHz GaAs MMIC Power Amplifier
File Size	195.14K / 6 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	PB-CMM0015-BD-0000 CMM0015-BD-000V
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Test Instrumentation, Military, Space, Microwave Point-to-Poi...
Description	2.0-22.0 GHz GaAs MMIC Power Amplifier
File Size	199.42K / 6 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	PB-CMM0016-BD-0000 CMM0016-BD08 CMM0016-BD-000V CMM0016-BD
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Test Instrumentation, Military, Space, Microwave Point-to-Poi...
Description	2.0-22.0 GHz GaAs MMIC Power Amplifier
File Size	172.50K / 6 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	PB-CMM0618-BD-0000 CMM0618-BD07 CMM0618-BD CMM0618-BD-000V
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Test Instrumentation, Military, Space, Microwave Point-to-Poi...
Description	6.0-18.0 GHz GaAs MMIC Power Amplifier
File Size	150.85K / 5 Page	View it Online	Download Datasheet

				IXYS Corporation
Part No.	CLA40P1200FC
OCR Text	backside: isolated tav t v v 1,19 rrm 40 1200 = v = v i = a 2x features / advantages: applications: package: thyristor for line frequency planar passivated chip long-term stability line rectifying 50/60 hz softstart ac motor contr...
Description	High Efficiency Thyristor
File Size	395.58K / 5 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	PB-CMM1100-BD-0000 CMM1100-BD0704 CMM1100-BD-000V
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for fiber optic, microwave radio, military, space, telecom infras...
Description	2.0-18.0 GHz GaAs MMIC Low Noise Amplifier
File Size	208.41K / 5 Page	View it Online	Download Datasheet

For backside Found Datasheets File :: 7434 Search Time::8.047ms
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