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For chipscale Found Datasheets File :: 155    Search Time::6.609ms    
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    Maxim
Part No. MAX4256 MAX4255
OCR Text ...X4252 is available in an 8-bump chipscale package (UCSPTM) and the MAX4253 is available in a 10-bump UCSP. Features o Available in Space-Saving UCSP, SOT23, and MAX Packages o Low Distortion: 0.0002% THD (1k load) o 400A Quiescent Suppl...
Description "Low-Noise/Distortion, Low-Power, Rail-to-Rail Op Amp with Shutdown (Av > +10V/V)"
"Low-Noise/Distortion, Low-Power, Rail-to-Rail Op Amp (Av > +10V/V) in SOT23"

File Size 1,111.47K  /  19 Page

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    HFE4380-521 HFE4381-521

Finisar Corporation.
Part No. HFE4380-521 HFE4381-521
OCR Text ...arious plastics, chip on board, chipscale packages, etc. Custom packaging options LOCATION Allen, TX - Business unit headquarters, VCSEL wafer growth, wafer fabrication and TO package assembly. Fremont, CA - Wafer growth and fabrication...
Description 1.25GBPS 850NM VCSEL SC TOSA PACKAGE

File Size 253.99K  /  6 Page

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    V850-2106-001 V850-TBD-001

Finisar Corporation.
Part No. V850-2106-001 V850-TBD-001
OCR Text ...arious plastics, chip on board, chipscale packages, etc. Custom packaging options LOCATION Allen, TX - Business unit headquarters, VCSEL wafer growth, wafer fabrication and TO package assembly. Fremont, CA - Wafer growth and fabrication...
Description 10GBPS 850NM VCSEL ARRAYS

File Size 202.79K  /  6 Page

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    HFE4081-321 HFE4082-321

Finisar Corporation.
Part No. HFE4081-321 HFE4082-321
OCR Text ...arious plastics, chip on board, chipscale packages, etc. Custom packaging options LOCATION Allen, TX - Business unit headquarters, VCSEL wafer growth, wafer fabrication and TO package assembly. Fremont, CA - Wafer growth and fabrication...
Description Attenuated VCSEL with Back Monitor Photodiode - VCSEL Anode Common

File Size 264.72K  /  6 Page

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    HFD7180-001 HFD7180-413

Finisar Corporation.
Part No. HFD7180-001 HFD7180-413
OCR Text ...arious plastics, chip on board, chipscale packages, etc. Custom packaging options LOCATION Allen, TX - Business unit headquarters, VCSEL wafer growth, wafer fabrication and TO package assembly. Fremont, CA - Wafer growth and fabrication...
Description 5 pin LC ROSA, with separate PD bias

File Size 278.64K  /  8 Page

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    CHC-CD0927KLF-01-4750 CHC-SCSI CHC-CD0927K-01-4750

IRC - a TT electronics Company.
Part No. CHC-CD0927KLF-01-4750 CHC-SCSI CHC-CD0927K-01-4750
OCR Text chipscale Termination Network CHC SCSI Series * Superior TaNFilm(R) resistors on ceramic substrate * Very low channel to channel capacitance * RoHS compliant terminations available * SCSI Ultra2 and Ultra3 compliant * 9 LVD termination lin...
Description SCSI LVD chipscale Termination Network

File Size 319.94K  /  1 Page

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    TS8314

Taiwan Semiconductor Company, Ltd
Part No. TS8314
OCR Text ...al MOSFET process technology in chipscale bondwireless packaging minimizes PCB space and RDS(ON) plus provides an ultralow Qg X RDS(ON) figure of merit. 130 O D 130 O Features * 6.5A, 20V RDS1(ON) equivalent = 15m at 4.5 Volts * 5....
Description Bi-directional N-Channel 2.5V Specified MicroSURF垄芒

File Size 1,846.36K  /  28 Page

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    CHC-CD0865A-01-10R0F CHC-CD0865A-01-10R0G CHC-CD0865A-01-10R0J CHC-CD1065B-01-75R0F CHC-CD1065B-01-75R0G CHC-CD1065B-01-

IRC - a TT electronics Company.
Part No. CHC-CD0865A-01-10R0F CHC-CD0865A-01-10R0G CHC-CD0865A-01-10R0J CHC-CD1065B-01-75R0F CHC-CD1065B-01-75R0G CHC-CD1065B-01-75R0J CHC-CD1065A-01-75R0F CHC-CD1065A-01-75R0G CHC-CD1065A-01-75R0J CHC-CD1065A-01-15R0F CHC-CD1065A-01-15R0G CHC-CD1065A-01-15R0J CHC-CD0910BLF-01-75R0F CHC-CD0910BLF-01-75R0G CHC-CD0910BLF-01-75R0J CHC-CD0910B-01-15R0F CHC-CD0910B-01-15R0G CHC-CD0910B-01-15R0J CHC-CD0910B-01-10R0F CHC-CD0910B-01-10R0G CHC-CD0910B-01-10R0J CHC-CD0910A-01-75R0F CHC-CD0910A-01-75R0G CHC-CD0910A-01-75R0J CHC-CD0910A-01-15R0F CHC-CD0910A-01-15R0G CHC-CD0910A-01-15R0J CHC-CD0865B-01-75R0F CHC-CD0865B-01-75R0G CHC-CD0865B-01-75R0J CHC-CD0865ALF-01-75R0F CHC-CD0865ALF-01-75R0G CHC-CD0865ALF-01-75R0J CHC-CD0865ALF-01-15R0F CHC-CD0865ALF-01-15R0G CHC-CD0865ALF-01-15R0J CHC-CD0865ALF-01-10R0F CHC-CD0865ALF-01-10R0G CHC-CD0865ALF-01-10R0J CHC-CD0865A-01-15R0F CHC-CD0865A-01-15R0G CHC-CD0865A-01-15R0J CHC-CC0910BLF-01-75R0F CHC-CC0910BLF-01-75R0G CHC-CC0910BLF-01-75R0J CHC-CC0910BLF-01-10R0F CHC-CC0910BLF-01-10R0G CHC-CC0910BLF-01-10R0J CHC-CC0910ALF-01-75R0F CHC-CC0910ALF-01-75R0G CHC-CC0910ALF-01-75R0J CHC-CC0910A-01-10R0F CHC-CC0910A-01-10R0G CHC-CC0910A-01-10R0J CHC-CB0565B-01-75R0F CHC
OCR Text ...Ball grid terminations IRC's chipscale on ceramic CHC offers high performance terminal solutions in a small surface mount package. Sn/Pb solder balls placed on a ceramic substrate permit very low parasitic inductance and capacitance. Thi...
Description Ceramic Ball Grid Termination Arrays

File Size 1,137.79K  /  4 Page

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    HFE7192-661 HFE7192-561 HFE7192-581 HFE7192-681

Finisar Corporation.
Part No. HFE7192-661 HFE7192-561 HFE7192-581 HFE7192-681
OCR Text ...arious plastics, chip on board, chipscale packages, etc. Custom packaging options LOCATION Allen, TX - Business unit headquarters, VCSEL wafer growth, wafer fabrication and TO package assembly. Fremont, CA - Wafer growth and fabrication...
Description 1/2/4/8 GBPS 850NM VCSEL LC TOSA PACKAGES

File Size 317.63K  /  7 Page

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    Maxim
Part No. DS3171 DS3172
OCR Text ...High-Density Thermally Enhanced chipscale BGA Packaging (TE-CSBGA) with 1.27mm Pin Pitch Industrial Temperature Operation: -40C to +85C IEEE1149.1 JTAG Test Port DETAILED DESCRIPTION The DS3171 (single), DS3172 (dual), DS3173 (triple), ...
Description Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers

File Size 1,902.35K  /  232 Page

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For chipscale Found Datasheets File :: 155    Search Time::6.609ms    
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