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Amphenol Communications Solutions |
| Part No. |
91113-02CA
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| Description |
Mechanism, 2.2mm s/o, Right Push Rod Eject, with EMI Clip, Narrow Body
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-1611 0879111611
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 16 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.87K /
6 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
91113-12CALF
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| Description |
Mechanism, 2.2mm s/o, Left Push Rod Eject, with EMI Clip, Narrow Body
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91113-12CA
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| Description |
Mechanism, 2.2mm s/o, Left Push Rod Eject, with EMI Clip, Narrow Body
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91113-14CA
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| Description |
Mechanism, 4.3mm s/o, Left Push Rod Eject, with EMI Clip, Narrow Body
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91113-04CA
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| Description |
Mechanism, 4.3mm s/o, Right Push Rod Eject, with EMI Clip, Narrow Body
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114829-11103LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 3 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114829-11108LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 8 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-1811 0879111811
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 18 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.87K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10005639-11134
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| Description |
DDR2 DIMM, Storage and Server Connector, Vertical, Through Hole, 240 Position, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879111411 87911-1411
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10037911-101LF
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| Description |
Mechanical Guidance Modules, Backplane Connectors, 10.8mm Guide Pin-Internal Thread.
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Official Product Page
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| Part No. |
X9111TB15I X9111TB15I-2.7
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| Description |
PLUG, CHASSIS, 4 WAY; Connector type:Circular; Gender:Plug; Ways, No. of:4; Material, contact:Copper Alloy; Plating, contact:Gold; Series:400 Series Micro Buccaneer; Contact style:Pin; Mounting type:Rear Panel Mount; Approval RoHS Compliant: Yes
ECON FO CERAMIC 62.5 PLENST/ST 15M
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| File Size |
157.90K /
21 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68491-118HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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