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  peeling Datasheet PDF File

For peeling Found Datasheets File :: 492    Search Time::1.343ms    
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    HKT100U HKT100Y01U

Renesas Electronics Corporation
Part No. HKT100U HKT100Y01U
OCR Text ...asurement condition> Cover tape peeling angle = 0 to 10 Rated Value Breaking force (F) = 0.10 to 0.69 N (10 to 70 g) peeling speed = 5 mm/s Carrier tape Carrier tape (enclosed device) flexibility Continuity Bending radius 30...
Description μ-Chip (RFID)
レ-Chip (RFID)

File Size 134.24K  /  14 Page

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    ROHM[Rohm]
Part No. MNA14
OCR Text ...15% Terminal adherence No peeling or sign of peeling on terminal. Pressure (5N) Test board Capacitor Appearance Resistance to vibration Rate of capacitance change Dissipation factor (tan) Solderability There must be no mechan...
Description From old datasheet system
Multi-layer ceramic chip capacitor networks

File Size 114.22K  /  9 Page

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    ROHM[Rohm]
Part No. MNA028CN105MK MNA02
OCR Text ... be allowed. voltage Without peeling or sign of peeling shall be allowed on the end terminations. As per 4.13 of JIS C 5101-1. As per 4.8 ofJIS C 5101-10 A 2N weight for 10+/-1s shall be applied to the soldered specimens as shown by t...
Description (1005 (0402) x 2 size, chip capacitor networks)

File Size 75.48K  /  7 Page

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    MCH558FN107ZP MCH55 MCH552FN107KP MCH552FN107MP MCH552FN107ZP MCH553FN107KP MCH553FN107ZP MCH554FN107KP MCH554FN107MP MC

ROHM[Rohm]
Part No. MCH558FN107ZP MCH55 MCH552FN107KP MCH552FN107MP MCH552FN107ZP MCH553FN107KP MCH553FN107ZP MCH554FN107KP MCH554FN107MP MCH554FN107ZP MCH555FN107KP MCH555FN107MP MCH555FN107ZP MCH558FN107KP MCH558FN107MP MCH553FN107MP
OCR Text ...ermination adherence Without peeling or sign of peeling shall be allowed on the end terminations. As per 4.13 of JIS C 5101-1. As per 4.8 ofJIS C 5101-10 A 5N weight for 10+/-1s shall be applied to the soldered specimens as shown by t...
Description Multi-layer ceramic chip capacitors

File Size 162.89K  /  10 Page

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    ROHM[Rohm]
Part No. MCH438FN476ZP MCH43 MCH432FN476JP MCH432FN476KP MCH432FN476MP MCH432FN476ZP MCH433FN476JP MCH433FN476KP MCH433FN476MP MCH433FN476ZP MCH434FN476JP MCH434FN476KP MCH434FN476MP MCH434FN476ZP MCH435FN476JP MCH435FN476KP MCH435FN476MP MCH435FN476ZP MCH438FN476JP MCH438FN476KP MCH438FN476MP
OCR Text ...ermination adherence Without peeling or sign of peeling shall be allowed on the end terminations. As per 4.13 of JIS C 5101-1. As per 4.8 ofJIS C 5101-10 A 5N weight for 10+/-1s shall be applied to the soldered specimens as shown by t...
Description Multi-layer ceramic chip capacitors

File Size 132.42K  /  11 Page

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    ROHM[Rohm]
Part No. MCH022A4R7DK MCH02 MCH022A010CK MCH022A020CK MCH022A030CK MCH022A040CK MCH022A050CK MCH022A060DK MCH022A070DK MCH022A0R5CK MCH022A4R7CK
OCR Text ... be allowed. voltage Without peeling or sign of peeling shall be allowed on the end terminations. As per 4.13 of JIS C 5101-1. As per 4.8 ofJIS C 5101-10 A 1N weight for 10+/-1s shall be applied to the soldered specimens as shown by t...
Description Multi-layer ceramic chip capacitors

File Size 66.36K  /  7 Page

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    SHARP[Sharp Electrionic Components]
Part No. LM8M64 LM8M64_07
OCR Text ...ipment which have a function of peeling or mechanism of friction(EX: Conveyer, soldering iron, working table), so the countermeasure countermeasure(electrostaticearth:1x108) should be made. 3. Floor Floor is a important part to leak static ...
Description Color STN LCD Module

File Size 776.54K  /  30 Page

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    SHARP[Sharp Electrionic Components]
Part No. LM7MS623
OCR Text ...ent which have a function of peeling or of friction(EX: iron, working table), so the countermeasure(electrostatic earth:1 X lo8 Q) should be made. 3.Floor Floor is a important There is a possibility part to leak static electrici...
Description DEVICE SPECIFICATION for Passive Matrix Monochrome LCD Module (640X240 dots)

File Size 1,264.40K  /  28 Page

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    TDK[TDK Electronics]
Part No. CHS-XS
OCR Text ... including the electrolysis and peeling of the humidity sensing material. * Please note that even when AC is used, the product will sustain the same type of damage as when DC is used if residual DC components or asymmetrical waveforms are p...
Description Humidity Sensors CHS Series CHS-XS Type

File Size 38.16K  /  2 Page

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    HIROSE[Hirose Electric]
ETC[ETC]
Part No. DF15C_6.2-50DP-0.65V_51 DF15 DF15_0.8-20DS-0.65V_50 DF15_0.8-20DS-0.65V_51 DF15_0.8-30DS-0.65V_50 DF15_0.8-30DS-0.65V_51 DF15_0.8-40DS-0.65V_50 DF15_0.8-40DS-0.65V_51 DF15_0.8-50DS-0.65V_50 DF15_0.8-50DS-0.65V_51 DF15_1.8-20DS-0.65V_50 DF15_1.8-20DS-0.65V_51 DF15_1.8-30DS-0.65V_50 DF15_1.8-30DS-0.65V_51 DF15_1.8-40DS-0.65V_50 DF15_1.8-40DS-0.65V_51 DF15_1.8-50DS-0.65V_50 DF15_1.8-50DS-0.65V_51 DF15_3.2-20DP-0.65V_50 DF15_3.2-20DP-0.65V_51 DF15_3.2-30DP-0.65V_50 DF15_3.2-30DP-0.65V_51 DF15_3.2-40DP-0.65V_50 DF15_3.2-40DP-0.65V_51 DF15_3.2-50DP-0.65V_50 DF15_3.2-50DP-0.65V_51 DF15_4.2-20DP-0.65V_50 DF15_4.2-20DP-0.65V_51 DF15_4.2-30DP-0.65V_50 DF15_4.2-30DP-0.65V_51 DF15_4.2-40DP-0.65V_50 DF15_4.2-40DP-0.65V_51 DF15_4.2-50DP-0.65V_50 DF15_4.2-50DP-0.65V_51 DF15_6.2-20DP-0.65V_50 DF15_6.2-20DP-0.65V_51 DF15_6.2-30DP-0.65V_50 DF15_6.2-30DP-0.65V_51 DF15_6.2-40DP-0.65V_50 DF15_6.2-40DP-0.65V_51 DF15_6.2-50DP-0.65V_50 DF15_6.2-50DP-0.65V_51 DF15A_0.8-20DS-0.65V_50 DF15A_0.8-20DS-0.65V_51 DF15A_0.8-30DS-0.65V_50 DF15A_0.8-30DS-0.65V_51 DF15A_0.8-40DS-0.65V_50 DF15A_0.8-40DS-0.65V_51 DF15A_0.8-50DS-0.65V_50 DF15A_0.8-50DS-0.65V_51 DF15A_1.8-20DS-0.65V_50 DF15A_1.8-20DS-0.65V_51 DF15A_1.8-3
OCR Text ...metal fitting to prevent solder peeling is prepared, considering the mounting on FPC. sApplications Mobile phone, LCD(Liquid Crystal Display), MO(Optical Disk), Note PC A286 sProduct Specifications Rating Current rating : 0.3A Op...
Description 0.65mm Pitch SMT Board to Board Connector

File Size 357.80K  /  11 Page

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For peeling Found Datasheets File :: 492    Search Time::1.343ms    
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