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  TIM-5510 Datasheet PDF File

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    TIM1414-8 TIM1414-8L

Toshiba Semiconductor
Part No. TIM1414-8 TIM1414-8L
Description MICROWAVE POWER GaAs FET

File Size 132.46K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1109LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-8L
Description MICROWAVE POWER GaAs FET

File Size 132.08K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-G1110LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM0910-10
Description MICROWAVE POWER GaAs FET

File Size 112.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1108LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1414-2L
Description MICROWAVE POWER GaAs FET

File Size 114.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-G17-04
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1414-5L

Toshiba Semiconductor
Part No. TIM1414-5L
Description MICROWAVE POWER GaAs FET

File Size 147.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1104LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

   
Part No. TIM1213-8L
Description KU BAND, GaAs, N-CHANNEL, RF POWER, MOSFET

File Size 132.48K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1113LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

    TIM1414-7

Toshiba Semiconductor
Part No. TIM1414-7
Description MICROWAVE POWER GAAS FET

File Size 149.72K  /  6 Page

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Amphenol Communications Solutions

Part No. 55102-G1703LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    List of Unclassifed Man...
Part No. AS5510-DWLT
Description Linear Hall Sensor with IC Output

File Size 576.87K  /  29 Page

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Amphenol Communications Solutions

Part No. 55101-S3620LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM5053-8SL

Toshiba Semiconductor
Part No. TIM5053-8SL
Description MICROWAVE POWER GaAs FET

File Size 120.99K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-T17-22
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM5359-4SL

Toshiba Semiconductor
Part No. TIM5359-4SL
Description MICROWAVE POWER GaAs FET

File Size 169.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-G1715LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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