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  w baked Datasheet PDF File

For w baked Found Datasheets File :: 835    Search Time::1.562ms    
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    TLBGA1100T11

Toshiba Semiconductor
Part No. TLBGA1100T11
OCR Text ...mount devices ? 3.2 (l) 2.9 (w) 1.9 (h) mm ? uv led chip + rgb phosphor ? colors: bluish green, reddish purple ? topr / tstg = -40...baked while packed in the tape reel. after baking, use the baked devices within 72 hours, but perfo...
Description Panel Circuit Indicator

File Size 276.51K  /  8 Page

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    TK150F04K3L

Toshiba Semiconductor
Part No. TK150F04K3L
OCR Text ...238 150 175 -55 to 175 unit v a w mj a note: using continuously under heavy loads (e.g. the application of high temperature/curre...baked as follows: baking conditions: 125 for 48 hours. note: since the tape materials are not heat...
Description Switching Voltage Regulators
MOSFETs Silicon N-channel MOS (U-MOS?

File Size 275.52K  /  10 Page

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    TK80F04K3L

Toshiba Semiconductor
Part No. TK80F04K3L
OCR Text ...5 86 80 175 -55 to 175 unit v a w mj a note: using continuously under heavy loads (e.g. the application of high temperature/curre...baked as follows: baking conditions: 125 for 48 hours. note: since the tape materials are not heat...
Description Switching Voltage Regulators
MOSFETs Silicon N-channel MOS (U-MOS?

File Size 280.72K  /  10 Page

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    LIGITEK electronics co....
Part No. LG-CN3535VIRR-1-T1A-LSB
OCR Text ... unit power dissipation* pd 2.9 w dc forward current* if 1000 ma reverse current(vr=5v)* ir 10 a peak pulse current duty1/10@10khz* i fp 10...baked for >72 hours at 605c / 5% rh.performing baking only once, and using the baked devices with...
Description    SURFACE MOUNT LED TAPE AND REEL

File Size 474.49K  /  15 Page

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    TK80F06K3L

Toshiba Semiconductor
Part No. TK80F06K3L
OCR Text ...5 57 80 175 -55 to 175 unit v a w mj a note: using continuously under heavy loads (e.g. the application of high temperature/curre...baked as follows: baking conditions: 125 for 48 hours. note: since the tape materials are not heat...
Description Switching Voltage Regulators
MOSFETs Silicon N-channel MOS (U-MOS?

File Size 285.18K  /  10 Page

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    TK40F08K3

Toshiba Semiconductor
Part No. TK40F08K3
OCR Text ...sipation (tc = 25c) p d 107 w single pulse avalanche energy (note 2) e as 164 mj avalanche current i ar 40 a repetitive avalanc...baked as follows: baking conditions: 125 c for 48 hours. since the tape materials are not heat-pr...
Description Swiching Regulator, DC-DC Converter Applications Motor Drive Applications

File Size 210.33K  /  7 Page

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    LIGITEK electronics co....
Part No. LG-CN3535HIRR-1-T1A-LSB
OCR Text ... unit power dissipation* pd 2.9 w dc forward current* if 1000 ma reverse current(vr=5v)* ir 10 a peak pulse current duty1/10@10khz* i fp 10...baked for >72 hours at 605c / 5% rh.performing baking only once, and using the baked devices with...
Description    SURFACE MOUNT LED TAPE AND REEL

File Size 486.61K  /  15 Page

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    TOSHIBA
Part No. TJ150F04M3L
OCR Text ...55 -150 175 -55 to 175 unit v a w mj a note: using continuously under heavy loads (e.g. the application of high temperature/curre...baked as follows: baking conditions: 125 for 48 hours. note: since the tape materials are not heat...
Description Power MOSFET (P-ch single)

File Size 277.11K  /  10 Page

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    TOSHIBA
Part No. TJ100F04M3L
OCR Text ...38 -100 175 -55 to 175 unit v a w mj a note: using continuously under heavy loads (e.g. the application of high temperature/curre...baked as follows: baking conditions: 125 for 48 hours. note: since the tape materials are not heat...
Description Power MOSFET (P-ch single)

File Size 279.85K  /  10 Page

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    Toshiba
Part No. TL1F1-Nw0
OCR Text ...es (1) size: 6.4 (l) mm 5.0 (w) mm 1.35 (h) mm (2) high luminous flux led: 112 lm (typ.) @i f = 350 ma (3) color: white (color temper...baked in taping with reel. after baking, use the baked device within 72 hours, but perform baking on...
Description LED Lamps

File Size 345.34K  /  13 Page

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For w baked Found Datasheets File :: 835    Search Time::1.562ms    
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