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  1809 Datasheet PDF File

For 1809 Found Datasheets File :: 145+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Freescale (Motorola)
Part No. MRF18090AR3
Description 1.80–1.88 GHz, 90 W, 26 V Lateral N–Channel RF Power MOSFET

File Size 228.93K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-809282000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Freescale Semiconductor
Part No. MRF18090BR3
Description LATERAL N-CHANNEL RF POWER MOSFETs

File Size 409.16K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-809071800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    LT1809 LT1809CS8 LT1809IS8 1809I

LINEAR TECHNOLOGY CORP
LINER[Linear Technology]
Part No. LT1809 LT1809CS8 LT1809IS8 1809I
Description 180MHz/ 350V/ms Rail-to-Rail Input and Output Low Distortion Op Amp
180MHz, 350V/ms Rail-to-Rail Input and Output Low Distortion Op Amp
From old datasheet system

File Size 138.66K  /  8 Page

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Amphenol Communications Solutions

Part No. 77311-118-09LF
Description BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions
Tech specs    

Official Product Page

    MAX1809EEE MAX1809ETI MAX1809

Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
Part No. MAX1809EEE MAX1809ETI MAX1809
Description 3A / 1MHz / DDR Memory Termination Supply
3A, 1MHz, DDR Memory Termination Supply 3AMHz、DDR存储器端接电
" 3A, 1MHz, DDR Memory Termination Supply"
3A 1MHz DDR Memory Termination Supply

File Size 799.61K  /  17 Page

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Amphenol Communications Solutions

Part No. 77311-418-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    飞思卡尔半导体(中国)有限公司
Part No. MRF18090BSR3
Description RF Power Field Effect Transistors N-Channel Enhancement-Mode Lateral MOSFETs 射频功率场效应晶体管N沟道增强型MOSFET的外

File Size 385.00K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-809161550LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MAXIM - Dallas Semiconductor
Part No. MAX1809EVKIT
Description From old datasheet system
Evaluation Kit for the MAX1809

File Size 166.09K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-105180950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    IP3337CX1809 IP3337CX18/LF/P13

NXP Semiconductors N.V.
Part No. IP3337CX1809 IP3337CX18/LF/P13
Description 7-channel integrated LC-filter network with ESD input protection to IEC 61000-4-2 level 4

File Size 75.73K  /  12 Page

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Amphenol Communications Solutions

Part No. 54111-809201800LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K7A803609A K7A801809A
Description 256Kx36Bit Synchronous Pipelined Burst SRAM Data Sheet
512Kx18-Bit Synchronous Pipelined Burst SRAM Data Sheet

File Size 534.84K  /  20 Page

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Amphenol Communications Solutions

Part No. 54121-809081450LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    551-0209F 551-0309F 551-0409F 551-0509F 551-0609F 551-0709F 551-0809F 551-3009F 551-1209F C-17296 551-3109F 551-2509F 55

Dialight Corporation
Part No. 551-0209F 551-0309F 551-0409F 551-0509F 551-0609F 551-0709F 551-0809F 551-3009F 551-1209F C-17296 551-3109F 551-2509F 551-1809F 551-1109F
Description 3mm LED CBI RoHS COMPLIANT

File Size 152.02K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-818-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7A801809A K7A803609A
Description 256Kx36 & 512Kx18 Synchronous SRAM

File Size 366.99K  /  20 Page

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Amphenol Communications Solutions

Part No. 54121-809201800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 1809 Found Datasheets File :: 145+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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