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Amphenol Communications Solutions |
| Part No. |
68020-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79821-162HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68482-162HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68492-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79257-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Linear Technology, Corp.
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| Part No. |
22274
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| Description |
Data Management Software (DMS) for AMD Simultaneous Read/Write Flash Memory Devices 数据管理软件（简称DMS）为AMD同步写闪存设
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| File Size |
159.80K /
10 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68405-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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IMP[IMP, Inc]
IMP Inc
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| Part No. |
C1227
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| Description |
ECONOLINE: RSS & RSD - 1kVDC and 3KVDC Isolation- Internal SMD Construction- UL94V-0 Package Material- Toroidal Magnetics- Efficiency to 85%- SMD5, SMD8, SMD10 and SMD12 case styles 30V的高压BiCMOS工艺1.2毫米双金双聚
From old datasheet system
HV BiCMOS 1.2mm 30V Double Metal - Double Poly
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| File Size |
26.81K /
2 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68691-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68695-162HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54mm Pitch, Right Angle, 5.84mm (0.23in) Mating, 2.29mm (0.09in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68697-162HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67996-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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