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  2811 Datasheet PDF File

For 2811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    39-28-1123 0039281123

Molex Electronics Ltd.
Part No. 39-28-1123 0039281123
Description 4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 12 Circuits

File Size 500.20K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114828-11206LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 6 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    39-28-1103 0039281103

Molex Electronics Ltd.
Part No. 39-28-1103 0039281103
Description 4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock

File Size 499.94K  /  6 Page

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Amphenol Communications Solutions

Part No. 54112-811121900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    22-28-1131 0022281131

Molex Electronics Ltd.
Part No. 22-28-1131 0022281131
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Friction Lock, 13 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 311.14K  /  8 Page

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Amphenol Communications Solutions

Part No. 10114828-11115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    87911-2811 0879112811

Molex Electronics Ltd.
Part No. 87911-2811 0879112811
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free

File Size 360.88K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114828-11110LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 10 Positions
Tech specs    

Official Product Page

    0681452811 68145-2811

Molex Electronics Ltd.
Part No. 0681452811 68145-2811
Description 2.50mm (.098") Pitch Wire-to-Board Header, 1.02mm (.040") Tab Type, Vertical, 28Circuits, Black
2.50mm (.098) Pitch Wire-to-Board Header, 1.02mm (.040) Tab Type, Vertical, 28Circuits, Black

File Size 136.11K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-811042400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0022281130-17

Molex Electronics Ltd.
Part No. 0022281130-17
Description    KK 254 Breakaway Header, Right-Angle with Friction Lock, 13 Circuits, Tin (Sn) Plating

File Size 39.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-811161900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0432028113-17

Molex Electronics Ltd.
Part No. 0432028113-17
Description    Modular Jack, Right Angle, Low Profile, 8/8, Key

File Size 26.84K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-811401800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0022281131-17

Molex Electronics Ltd.
Part No. 0022281131-17
Description    KK 254 Breakaway Header, Right-Angle with Friction Lock, 13 Circuits, 0.38m

File Size 39.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114828-11106LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 6 Positions
Tech specs    

Official Product Page

    0022281171

Molex Electronics Ltd.
Part No. 0022281171
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Friction Lock, 17 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 311.15K  /  8 Page

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Amphenol Communications Solutions

Part No. 10114828-11108LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 8 Positions
Tech specs    

Official Product Page

    UPA2811T1L-E2-AY UPA2811T1L-E1-AY

Renesas Electronics Corporation
Part No. UPA2811T1L-E2-AY UPA2811T1L-E1-AY
Description MOS FIELD EFFECT TRANSISTOR

File Size 216.45K  /  8 Page

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Amphenol Communications Solutions

Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 2811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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