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  3323 Datasheet PDF File

For 3323 Found Datasheets File :: 137+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 |   

    SAMSUNG[Samsung semiconductor]
Part No. M464S3323BN0-C1L_L1L M464S3323BN0 M464S3323BN0-C1H_L1H M464S3323BN0-C1H/L1H M464S3323BN0-C1L/L1L
Description 144pin SDRAM SODIMM

File Size 123.62K  /  9 Page

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Amphenol Communications Solutions

Part No. 70233-231LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, 48 Position, Straight, Press-Fit, Wide body.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    ONSEMI[ON Semiconductor]
Part No. MC3323207 MC33232PG MC33232 MC33232D MC33232DG MC33232DR2 MC33232DR2G MC33232P
Description Power Factor Controller

File Size 210.32K  /  15 Page

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Amphenol Communications Solutions

Part No. 68033-232HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    KEMET, Corp.
Part No. GMM27333230ATG-75
Description x72 SDRAM Module x72内存模块

File Size 608.67K  /  12 Page

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Amphenol Communications Solutions

Part No. 10131933-230ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 30 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

   
Part No. GMM27333230ATG-7J
Description x72 SDRAM Module

File Size 170.23K  /  14 Page

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Amphenol Communications Solutions

Part No. 76383-323LF
Description Dubox®2.54mm, Board to Board Connector, Shrouded Header, Double Row, Right Angle.
Tech specs    

Official Product Page

    CD4071BMS CD4072BMS CD4075BMS FN3323 CD4071 CD4072

INTERSIL[Intersil Corporation]
Part No. CD4071BMS CD4072BMS CD4075BMS FN3323 CD4071 CD4072
Description OR-Gate, 2-Input, Quad, Rad-Hard, CMOS, Logic
CMOS OR Gate
From old datasheet system

File Size 113.59K  /  10 Page

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Amphenol Communications Solutions

Part No. 10131933-232ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 32 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    Hynix Semiconductor, Inc.
Part No. GMM77332380CNTG-5 GMM77332380CNTG-6
Description 32M X 72 EDO DRAM MODULE, 50 ns, DMA168 DIMM-168
32M X 72 EDO DRAM MODULE, 60 ns, DMA168 DIMM-168

File Size 712.10K  /  27 Page

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Amphenol Communications Solutions

Part No. 68033-236HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

   
Part No. GMM26433233ANTG-7J
Description X64的内存模

File Size 215.23K  /  16 Page

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Amphenol Communications Solutions

Part No. 10131933-236ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 36 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    KEMET, Corp.
Part No. GMM27333230ANTG-7J GMM27333230ANTG-10K
Description x72 SDRAM Module x72内存模块

File Size 170.99K  /  14 Page

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Amphenol Communications Solutions

Part No. 85833-236LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body, 4 Mod.
Tech specs    

Official Product Page

    MAXIM INTEGRATED PRODUCTS INC
Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
Part No. MAX3323E MAX3322E MAX3323EEPE MAX3322EEUP MAX3323EEUE
Description 5V High-Speed RS-232 Transceivers with 0.1uF Capacitors
Octal LVDS Receiver 38-TSSOP -40 to 85
" ?à15kV ESD-Protected, RS- 232 Transceivers for Multidrop Applications"
±15kV ESD-Protected, RS-232 Transceivers for Multidrop Applications

File Size 325.37K  /  13 Page

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Amphenol Communications Solutions

Part No. 10136647-033231LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 15u\\ Gold (Tin on Tails) plating, Black Color, 3 Positions, GW Compatible, with Posts, Tray packing.
Tech specs    

Official Product Page

    Nihon Dempa Kogyo Co., Ltd.
Integrated Silicon Solution, Inc.
NIHON DEMPA KOGYO CO LTD
Part No. NV13M08YG-2.0M-NSA3323G NV13M08YH-FREQ-NSA3323H NV13M08YH-2.0M-NSA3323H NV13M08YH-100M-NSA3323H NV13M08YD-2.0M-NSA3323D NV13M08YF-185M-NSA3323F NV13M08YJ-185M-NSA3323J
Description VCXO, CLOCK, 2 MHz, CMOS OUTPUT ROHS COMPLIANT PACKAGE-6
VCXO, CLOCK, 2 MHz - 100 MHz, CMOS OUTPUT ROHS COMPLIANT PACKAGE-6
VCXO, CLOCK, 100 MHz, CMOS OUTPUT ROHS COMPLIANT PACKAGE-6
VCXO, CLOCK, 185 MHz, PECL OUTPUT ROHS COMPLIANT PACKAGE-6

File Size 83.38K  /  1 Page

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Amphenol Communications Solutions

Part No. 69133-234
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 3323 Found Datasheets File :: 137+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 |   

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