|
|
 |
Amphenol Communications Solutions |
Part No. |
51617-XX002LF
|
Description |
PwrBlade®, Power Supply Connectors, 5P 24S 1M 7P PF Vertical Receptacle.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
84516-102
|
Description |
200 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
0757575141 75757-5141
|
Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 2.50μm(100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 2.50μm(100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail
|
File Size |
166.21K /
4 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
131-3516-11D
|
Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
0757575221 75757-5221
|
Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
|
File Size |
166.27K /
4 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
131-8516-11D
|
Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
131-7516-11H
|
Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54112-516122300LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
131-7516-11D
|
Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
131-6516-11H
|
Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
F516-1A7H1-21014
|
Description |
Flex Connector, 1.00mm Pitch, Height 2.00mm, Right angle, Flip type, ZIF, 14 position, With MYLAR
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
0757576281 75757-6281
|
Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25渭m (50渭) Nickel (Ni) Overall, 2.50渭m (100渭) Minimum Select Matte Tin (Sn) Plating on Ta 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
|
File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
10137925-1612LF
|
Description |
Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 16 Positions, Non GW Compatible LCP, Tape and Reel. .
|
Tech specs |
|
|
|
Official Product Page
|
|

Bom2Buy.com

Price and Availability
|