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  8052-1313-AU Datasheet PDF File

For 8052-1313-AU Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Electronic Film Capacitors
Part No. 1313DFR
Description Standard Metallized Polyester Capacitors

File Size 28.30K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-3318-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Hammond Manufacturing Ltd.
Part No. 18G1313
Description DATA SUBJECT TO CHANGE WITHOUT NOTLCE
Data subject to change without notice Isometric drawing Not to Scale

File Size 78.28K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-3114-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    LPC1313

NXP Semiconductors
Part No. LPC1313
Description 32-bit ARM Cortex-M3 microcontroller/ up to 32 kB flash and 8 kB SRAM/ USB device

File Size 311.38K  /  53 Page

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Amphenol Communications Solutions

Part No. 131-3416-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    CN13132

Cree, Inc
Part No. CN13132
Description Mirella series

File Size 1,228.06K  /  27 Page

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Amphenol Communications Solutions

Part No. 131-3118-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    QRD1313

Fairchild Semiconductor
Part No. QRD1313
Description REFLECTIVE OBJECT SENSOR

File Size 180.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3514-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    TOSHIBA
Part No. 2SA1313
Description Transistor Silicon PNP Epitaxial Type (PCT process) Audio Frequency Low Power Amplifier Applications Driver Stage Amplifier Applications Switching Applications

File Size 98.63K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-3216-21H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Double End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    Hammond Manufacturing L...
Part No. 18P1313
Description Data subject to change without notice Isometric drawing Not to Scale

File Size 77.86K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-3518-21H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    HPI1313

EPCOS
Part No. HPI1313
Description High-Power Inductors

File Size 286.03K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-3218-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    2SD1313

MOSPEC[Mospec Semiconductor]
Part No. 2SD1313
Description POWER TRANSISTORS(25A,350V,200W)

File Size 120.57K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3614-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    EEH1313

Sumida Corporation
Part No. EEH1313
Description xDSL POTs Splitter Pin Type: EEH Series

File Size 142.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-3316-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

For 8052-1313-AU Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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