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  85009-0854 Datasheet PDF File

For 85009-0854 Found Datasheets File :: 111+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 |   

    0713085408 71308-5408

Molex Electronics Ltd.
Part No. 0713085408 71308-5408
Description 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u") Minimum
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 54242-108500950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0713085406 71308-5406

Molex Electronics Ltd.
Part No. 0713085406 71308-5406
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10085429-11123TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0713085404 71308-5404

Molex Electronics Ltd.
Part No. 0713085404 71308-5404
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10085429-41223TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0713085420 71308-5420

Molex Electronics Ltd.
Part No. 0713085420 71308-5420
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10118085-401-12LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded horizontal header, Surface mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch, with peg.
Tech specs    

Official Product Page

    MASW-008543 MASW-008543-000000 MASW-008543-001SMB MASW-008543-TR3000

M/A-COM Technology Solutions, Inc.
Part No. MASW-008543 MASW-008543-000000 MASW-008543-001SMB MASW-008543-TR3000
Description SPDT High Isolation Terminated Switch 0.01- 4.0 GHz

File Size 166.80K  /  4 Page

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Amphenol Communications Solutions

Part No. 10085429-11223TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0713085418 71308-5418

Molex Electronics Ltd.
Part No. 0713085418 71308-5418
Description 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10085429-11113TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0713085414 71308-5414

Molex Electronics Ltd.
Part No. 0713085414 71308-5414
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10085429-11023TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0713085410 71308-5410

Molex Electronics Ltd.
Part No. 0713085410 71308-5410
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10118085-401A04LF
Description Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 4 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    SD-71308-001 0713085460

Molex Electronics Ltd.
Part No. SD-71308-001 0713085460
Description 2.54mm (.100) Pitch C-Grid? Header

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10085429-11213TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    SD-71308-001 0713085436

Molex Electronics Ltd.
Part No. SD-71308-001 0713085436
Description 2.54mm (.100) Pitch C-Grid? Header

File Size 1,475.28K  /  8 Page

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