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  87759-1851 Datasheet PDF File

For 87759-1851 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-7637

Molex Electronics Ltd.
Part No. 87759-7637
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 355.71K  /  6 Page

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Amphenol Communications Solutions

Part No. 87185-127HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-3276

Molex Electronics Ltd.
Part No. 87759-3276
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 355.72K  /  6 Page

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Amphenol Communications Solutions

Part No. 87185-104HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    87759-1814

Molex Electronics Ltd.
Part No. 87759-1814
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.10K  /  8 Page

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Amphenol Communications Solutions

Part No. 87185-116HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    87759-1450

Molex Electronics Ltd.
Part No. 87759-1450
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 174.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 87185-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    87759-1665

Molex Electronics Ltd.
Part No. 87759-1665
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 10110818-5100HFLF
Description SFP+ Cable Assembly, 24 AWG, 10.0 meters, passive -standard raw cable, halogen free.
Tech specs    

Official Product Page

    87759-1875

Molex Electronics Ltd.
Part No. 87759-1875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-8516-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    87759-1650

Molex Electronics Ltd.
Part No. 87759-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free

File Size 174.11K  /  4 Page

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Amphenol Communications Solutions

Part No. 87185-103HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    87759-4074

Molex Electronics Ltd.
Part No. 87759-4074
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 420.21K  /  8 Page

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Amphenol Communications Solutions

Part No. 87185-131HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    87759-3464

Molex Electronics Ltd.
Part No. 87759-3464
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 34 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 420.98K  /  8 Page

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Amphenol Communications Solutions

Part No. 67118-518LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Right Angle, Through Hole, Top Entry, Double Row, 36 position, 2.54mm (.100in) Pitch.
Tech specs    

Official Product Page

    87759-4874

Molex Electronics Ltd.
Part No. 87759-4874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 87185-121HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

For 87759-1851 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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