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  gold-plated Datasheet PDF File

For gold-plated Found Datasheets File :: 10927    Search Time::4.891ms    
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    HPMX-2003

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
http://
Part No. HPMX-2003
OCR Text ... self-alignment techniques, and gold metallization to produce RFICs with superior performance, uniformity and reliability. Applications ...plated through via holes where these leads contact the PC board. Iref (pin 12) and Q ref (pin 5), I ...
Description Silicon Bipolar RFIC 900 MHz Vector Modulator

File Size 289.20K  /  16 Page

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    HPMX-2005

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
http://
Part No. HPMX-2005
OCR Text ...on-implantation techniques, and gold metallization to produce state of the art RFICs. Pin Configuration VCC 1 V CC 2 GROUND 3 GROUND 4 Q...plated through via holes where these leads contact the PC board. Iref (pin 12) and Q ref (pin 5) Imo...
Description Silicon Bipolar RFIC 100 MHz Vector Modulator

File Size 501.84K  /  12 Page

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    HSMG-H670 HSMG-H690 HSMX-H670 HSMX-H690 HSMD-H670 HSMD-H690 HSMY-H670 HSMY-H690 HSMS-H690 HSMS-H670

Agilent(Hewlett-Packard...
http://
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
Part No. HSMG-H670 HSMG-H690 HSMX-H670 HSMX-H690 HSMD-H670 HSMD-H690 HSMY-H670 HSMY-H690 HSMS-H690 HSMS-H670
OCR Text ...( 0.004 INCH). 3. THE LEADS ARE GOLD PLATED; PLATING THICKNESS IS: GOLD - 0.05 MICRONS, NICKEL - 3 MICRONS, COPPER -18 MICRONS. , 1.00 1.60 0.60 0.30 0.80 TOPSIDE CATHODE MARK BOTTOMSIDE CATHODE MARK Absolute Maximu...
Description    Surface Mount Flip Chip LEDs
倒装芯片表面贴装发光二极

File Size 230.42K  /  8 Page

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    INA-51063 INA-51063-BLK INA-51063-TR1

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Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Electronic Theatre Controls, Inc.
Part No. INA-51063 INA-51063-BLK INA-51063-TR1
OCR Text ...ch isolation, ion implantation, gold metallization, and polyimide intermetal dielectric and scratch protection to achieve superior performan...plated through holes (vias) near the package terminals. The power supply connection to the amplifier...
Description Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; Number of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight
2.4 GHz Low Noise Silicon MMIC Amplifier 2.4千兆赫硅单片低噪声放大器

File Size 59.94K  /  5 Page

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    DF14-3030SCF DF14-3030SCFA DF14-3031SCF DF14-3031SCFA DF14-4S-1.25C DF14-4S-1.25H DF14-9S-1.25H DF14-10P-1.25C DF14-10P-

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HIROSE[Hirose Electric]
Hirose Electric USA, INC.
HIROSE ELECTRIC Co., Ltd.
Part No. DF14-3030SCF DF14-3030SCFA DF14-3031SCF DF14-3031SCFA DF14-4S-1.25C DF14-4S-1.25H DF14-9S-1.25H DF14-10P-1.25C DF14-10P-1.25H DF14-10S-1.25C DF14-10S-1.25H DF14-15P-1.25C DF14-15P-1.25H DF14-15S-1.25C DF14-15S-1.25H DF14-20P-1.25C DF14-20P-1.25H DF14-20S-1.25C DF14-20S-1.25H DF14-25P-1.25C DF14-25P-1.25H DF14-25S-1.25C DF14-25S-1.25H DF14-2626SCF DF14-2626SCFA DF14-2627SCF DF14-2627SCFA DF14-2628SCF DF14-2628SCFA DF14-2P-1.25C DF14-2P-1.25H DF14-2S-1.25C DF14-2S-1.25H DF14-3032SCF DF14-3032SCFA DF14-30P-1.25C DF14-30P-1.25H DF14-30S-1.25C DF14-30S-1.25H DF14-3P-1.25C DF14-3P-1.25H DF14-3S-1.25C DF14-3S-1.25H DF14-4P-1.25C DF14-4P-1.25H DF14-5P-1.25C DF14-5P-1.25H DF14-5S-1.25C DF14-5S-1.25H DF14-6P-1.25C DF14-6P-1.25H DF14-6S-1.25C DF14-6S-1.25H DF14-7P-1.25C DF14-7P-1.25H DF14-7S-1.25C DF14-7S-1.25H DF14-8P-1.25C DF14-8P-1.25H DF14-8S-1.25C DF14-8S-1.25H DF14-9P-1.25C DF14-9P-1.25H DF14-9S-1.25C DF14-7P-1.25H21 DF14-4P-1.25H20 DF14A-5P-1.25H50 DF14A-8P-1.25H20
OCR Text ...5 cycles Tin plating: 30 cycles Gold plating: 50 cycles Reflow: At the recommended temperature profile Manual soldering: 300c for 3 seconds ...plated or gold plated Beige Tin-lead plated or gold plated Tin-lead plated Remarks UL-94V-0 ------- ...
Description 8 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT
Silver Mica Capacitor; Capacitance:43pF; Capacitance Tolerance: 5%; Series:MIN; Voltage Rating:300VDC; Capacitor Dielectric Material:Mica; Package/Case:Surface Mount (SMD, SMT); Termination:SMD; Leaded Process Compatible:No RoHS Compliant: No
Single/Dual/Quad, 10MHz Single-Supply Op Amps
1.25mm Pitch Super Low profile Crimping Connector 1.25mm间距超低配置压着连接
7 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT
4 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT
5 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT

File Size 191.31K  /  6 Page

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    INFINEON[Infineon Technologies AG]
Part No. HYS64D3202 HYS64D16000GDL-6-C HYS64D32020HDL-6-C HYS64D16000HDL-6-C HYS64D32020GDL5C HYS64D32020GDL-5-C HYS64D32020GDL-6-C HYS64D32020HDL-5-C
OCR Text ...erence layout Raw Cards A and C Gold plated contacts Performance -5 Component Module @CL3 @CL2.5 @CL2 DDR400B PC3200-3033 -6 DDR333B PC2700-2533 166 166 133 Unit -- -- MHz MHz MHz Table 1 Part Number Speed Code Speed Grade max. Clock ...
Description DDR SDRAM Modules - 256MB (32Mx64) PC2100 2-bank; Available 2Q04
DDR SDRAM Modules - 256MB (32Mx64) PC3200 2-bank; Available 2Q04
DDR SDRAM Modules - 256MB (32Mx64) PC2700 2-bank; Available 2Q04
200-Pin Small Outline Dual-In-Line Memory Modules

File Size 586.90K  /  30 Page

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    INFINEON[Infineon Technologies AG]
Part No. HYS64D6402 HYS64D64020HDL-6-B HYS64D64020GDL HYS64D64020GDL-5-B HYS64D64020GDL-6-B HYS64D64020HDL-5-B
OCR Text ... A DDR400 speed grade supported Gold plated contacts Performance -5 DDR400B PC3200-3033 -6 DDR333B PC2700-2533 166 166 133 Unit -- -- MHz MHz MHz Component Module @CL3 @CL2.5 @CL2 Table 1 Part Number Speed Code Speed Grade max. Clock ...
Description 200-Pin Small Outline Dual-In-Line Memory Modules

File Size 519.62K  /  27 Page

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    M48T37 M48T37V M48T37V-10MH1 M48T37V-10MH1TR M48T37V-10MH6 M48T37V-10MH6TR M48T37V-70MH1 M48T37V-70MH1TR M48T37V-70MH6 M

ST Microelectronics
STMicroelectronics
Part No. M48T37 M48T37V M48T37V-10MH1 M48T37V-10MH1TR M48T37V-10MH6 M48T37V-10MH6TR M48T37V-70MH1 M48T37V-70MH1TR M48T37V-70MH6 M48T37V-70MH6TR M48T37VMH M48T37VSH M48T37Y M48T37Y-10MH1 M48T37Y-10MH1TR M48T37Y-10MH6 M48T37Y-10MH6TR M48T37Y-70MH1 M48T37Y-70MH1TR M48T37Y-70MH6 M48T37Y-70MH6TR M48T37YMH M48T37YSH
OCR Text ...C package provides sockets with gold-plated contacts at both ends for direct connection to a separate SNAPHAT housing containing the battery and crystal. The unique design allows the SNAPHAT battery package to be mounted on top of the SOIC ...
Description 3.3V-5V 256 Kbit 32Kb x8 TIMEKEEPER SRAM

File Size 127.19K  /  20 Page

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    M4T28-BR12SH1 M4T28-BR12SH6 M4T32-BR12SH1 M4T32-BR12SH6 M4TXX-BR12SH M4T28-BR12SH M4T32-BR12SH M4TXX-BR12

意法半导
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
SGS Thomson Microelectronics
Part No. M4T28-BR12SH1 M4T28-BR12SH6 M4T32-BR12SH1 M4T32-BR12SH6 M4TXX-BR12SH M4T28-BR12SH M4T32-BR12SH M4TXX-BR12
OCR Text ...etween the pins and sockets are gold-plated to resist oxidation. Internally, each socket contains six independent contact fingers to form redundant connections between the two components. These sockets were designed with high point contact ...
Description TIMEKEEPER SNAPHAT Battery & Crystal
TIMEKEEPER SNAPHAT (Battery & Crystal)

File Size 50.03K  /  7 Page

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    UPC2708TB UPC2708TB-E3

NEC Corp.
NEC[NEC]
Part No. UPC2708TB UPC2708TB-E3
OCR Text ...on nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migr...plated on pattern 4. : Through holes For more information on the use of this IC, refer to the fol...
Description 5 V/ SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER
5 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER

File Size 96.76K  /  16 Page

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