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Amphenol Communications Solutions |
| Part No. |
131-3316-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69133-164HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3316-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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HI-G ITALIA SRL
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| Part No. |
IMGACG-12A
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| Description |
POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.031A (COIL), 12VDC (COIL), 372mW (COIL), 1A (CONTACT), 28VDC (CONTACT), PANEL MOUNT
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| File Size |
1,230.55K /
2 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-3316-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Hi-G Italia
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| Part No. |
IMGAPP-12B
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| Description |
POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.031A (COIL), 12VDC (COIL), 372mW (COIL), 1A (CONTACT), 28VDC (CONTACT), THROUGH HOLE-STRAIGHT MOUNT
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| File Size |
143.79K /
2 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69133-168HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Agilent (Hewlett-Packard)
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| Part No. |
MGA-85563 DEMO-MGA-85A
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| Description |
MGA-85563 · 3V LNA, 12 to 17dBm Adjustable OIP3, 0.8-6GHz, SOT363(SC-70)
DEMO-MGA-85A · Demonstration circuit board for MGA-85563 (0.8 - 6 GHz)
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| File Size |
156.53K /
14 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69133-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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HIROSE ELECTRIC Co., Ltd.
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| Part No. |
JMGAPD-26P
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| Description |
POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.017A (COIL), 26.5VDC (COIL), 450mW (COIL), 1A (CONTACT), THROUGH HOLE-STRAIGHT MOUNT
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| File Size |
109.17K /
1 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69133-166HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3316-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69133-160HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10118744-3133169LF
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| Description |
C - Commercial Series; Mezzanine Receptacle, SMT; 1mm Pitch; 69p
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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