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Amphenol Communications Solutions |
| Part No. |
131-6116-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-6116-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-6116-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87916-116HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
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| Tech specs |
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Official Product Page
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Ecliptek, Corp.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
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| Part No. |
MGA-64135
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| Description |
2 - 6 GHz Cascadable GaAs MMIC Amplifier 2 - 6 GHz的砷化镓MMIC放大器级
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| File Size |
42.16K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68016-116HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-6116-21D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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