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  THI3-2413 Datasheet PDF File

For THI3-2413 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Renesas
Part No. UPG2413T6Z
Description GaAs Integrated Circuit SP3T Switch

File Size 256.40K  /  13 Page

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Amphenol Communications Solutions

Part No. 68024-131HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    CY24130 CY24130-1 CY24130-2 CY24130ZXC-1 CY24130ZXC-1T CY24130ZXC-2 CY24130ZXC-2T

Cypress Semiconductor Corp.
Part No. CY24130 CY24130-1 CY24130-2 CY24130ZXC-1 CY24130ZXC-1T CY24130ZXC-2 CY24130ZXC-2T
Description HOTLink SMPTE Receiver Training Clock 培训HOTLink的SMPTE接收时钟
Coaxial Cable; Impedance:75ohm; Conductor Size AWG:30; No. Strands x Strand Size:7 x 38; Jacket Material:Polyvinylchloride (PVC); Conductor Material:Copper; Conductor Plating:Tin; Jacket Color:Matte Black RoHS Compliant: Yes
Coaxial Cable; Impedance:75ohm; Conductor Size AWG:30; No. Strands x Strand Size:7 x 38; Jacket Material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes RoHS Compliant: Yes
HOTLink II™ SMPTE Receiver Training Clock CY24130
HOTLink II(TM) SMPTE Receiver Training Clock Features
xHOTLink II(TM) SMPTE Receiver Training Clock

File Size 124.58K  /  5 Page

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Amphenol Communications Solutions

Part No. 68024-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

    RFMD[RF Micro Devices]
Part No. RF2413PCBA RF2413
Description GAIN CONTROLLED DUAL-CONVERSION QUADRATURE MODULATOR

File Size 122.46K  /  10 Page

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Amphenol Communications Solutions

Part No. 77311-824-13LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    ELM32413LA-S

ELM Technology Corporation
Part No. ELM32413LA-S
Description Single P-channel MOSFET

File Size 234.90K  /  4 Page

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Amphenol Communications Solutions

Part No. 93992-413HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 13 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MMBTSC2413

SEMTECH ELECTRONICS LTD.
Part No. MMBTSC2413
Description NPN Silicon Epitaxial Planar Transistor

File Size 216.48K  /  2 Page

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Amphenol Communications Solutions

Part No. G881MA24132S1EU
Description Micro Power 3.0 Connector System - G881 Series, Wire to Board connector, , Vertical, Dual row, 3.0mm pitch, 24 positions , 30u\\ Au, LCP, Black, REEL
Tech specs    

Official Product Page

    0022413061 22-41-3061

Molex Electronics Ltd.
Part No. 0022413061 22-41-3061
Description 2.54mm (.100") KK庐 IDT Double Cantilever Contact, 6 Circuits, Tin (Sn), Feed-To, 26 Stranded or Solid, and 28 Solid, Stranded, or Fused, Brown ID Strip
2.54mm (.100) KK? IDT Double Cantilever Contact, 6 Circuits, Tin (Sn), Feed-To, 26 Stranded or Solid, and 28 Solid, Stranded, or Fused, Brown ID Strip

File Size 484.65K  /  20 Page

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Amphenol Communications Solutions

Part No. 68024-135HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

    0022413031 22-41-3031

Molex Electronics Ltd.
Part No. 0022413031 22-41-3031
Description 2.54mm (.100) KK? IDT Double Cantilever Contact, 3 Circuits, Tin (Sn), Feed-To, 26 Stranded or Solid, and 28 Solid, Stranded, or Fused, Brown ID Strip
MOLEX Connector

File Size 484.91K  /  20 Page

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Amphenol Communications Solutions

Part No. 77311-124-13LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0022413032 22-41-3032

Molex Electronics Ltd.
Part No. 0022413032 22-41-3032
Description 2.54mm (.100) KK IDT Double Cantilever Contact, 3 Circuits, Tin (Sn)
MOLEX Connector

File Size 484.92K  /  20 Page

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Amphenol Communications Solutions

Part No. 77311-424-13LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0022413052 22-41-3052

Molex Electronics Ltd.
Part No. 0022413052 22-41-3052
Description 2.54mm (.100) KK? IDT Double Cantilever Contact, 5 Circuits, Tin (Sn), Feed-To, 24 Stranded, Solid, Fused, Topcoat, and 26 Fused and Topcoat, Green ID Strip
MOLEX Connector

File Size 484.92K  /  20 Page

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Amphenol Communications Solutions

Part No. 68024-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

    0022413062 22-41-3062

Molex Electronics Ltd.
Part No. 0022413062 22-41-3062
Description 2.54mm (.100) KK? IDT Double Cantilever Contact, 6 Circuits, Tin (Sn), Feed-To, 24 Stranded, Solid, Fused, Topcoat, and 26 Fused and Topcoat, Green ID Strip
MOLEX Connector

File Size 484.92K  /  20 Page

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Amphenol Communications Solutions

Part No. 68422-413HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

For THI3-2413 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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