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  TIM-5510 Datasheet PDF File

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    TIM3742-8SL

Toshiba Semiconductor
Part No. TIM3742-8SL
Description MICROWAVE POWER GaAs FET

File Size 123.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1109LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TIM3742-4UL

Toshiba Semiconductor
Part No. TIM3742-4UL
Description MICROWAVE POWER GaAs FET

File Size 168.29K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-G1110LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1414-7-252

Toshiba Semiconductor
Part No. TIM1414-7-252
Description HIGH POWER P1dB=38.0 dBm at 13.75 GHz to 14.5 GHz

File Size 146.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1108LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1414-18L

Toshiba Semiconductor
Part No. TIM1414-18L
Description MICROWAVE POWER GaAs FET

File Size 112.72K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-G17-04
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1011-10L

Toshiba Semiconductor
Part No. TIM1011-10L
Description MICROWAVE POWER GaAs FET

File Size 133.53K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1104LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM6472-4UL

Toshiba Semiconductor
Part No. TIM6472-4UL
Description MICROWAVE POWER GaAs FET

File Size 43.97K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1113LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

    TIM7785-6UL

Toshiba Semiconductor
Part No. TIM7785-6UL
Description MICROWAVE POWER GaAs FET

File Size 43.59K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-G1703LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM6472-4SL

Toshiba Semiconductor
Part No. TIM6472-4SL
Description MICROWAVE POWER GaAs FET

File Size 147.10K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-S3620LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1011-15L

Toshiba Semiconductor
Part No. TIM1011-15L
Description P1dB=42.0dBm at 10.7GHz to 11.7GHz

File Size 496.11K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-T17-22
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1414-30L

Toshiba Semiconductor
Part No. TIM1414-30L
Description MICROWAVE POWER GaAs FET

File Size 45.53K  /  2 Page

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Amphenol Communications Solutions

Part No. 55101-G1715LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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