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treatment Datasheet PDF File

For treatment Found Datasheets File :: 5486 Search Time::1.406ms
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				SONY[Sony Corporation]
Part No.	CXG1016N
OCR Text	...SSOP-8P-L01 SSOP008-P-0044 LEAD treatment LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER / PALLADIUM PLATING COPPER ALLOY 0.04g --4-- (0.5) 0.6 0.15
Description	From old datasheet system High-Frequency SPDT Antenna Switch
File Size	78.98K / 4 Page	View it Online	Download Datasheet

				http:// SONY[Sony Corporation]
Part No.	CXG1017 CXG1017N
OCR Text	...SSOP-8P-L01 SSOP008-P-0044 LEAD treatment LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER / PALLADIUM PLATING COPPER ALLOY 0.04g -7- (0.5) 0.6 0.15
Description	GSM1800/1900 DPDT TX/RX Antenna Switch
File Size	98.89K / 7 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXG1050TN
OCR Text	...E JEDEC CODE TSSOP-16P-L01 LEAD treatment LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.03g -8- 0.1 0.01 + 0.026 0.12 - 0.02 0.45 0.1 1 8 X4 3.9
Description	Receiving Dual-Band Mixer
File Size	112.75K / 8 Page	View it Online	Download Datasheet

				Sony Corporation
Part No.	CXG1051AFN
OCR Text	...ODE JEDEC CODE HSOF-26P-01 LEAD treatment LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.06g Kokubu Ass'y HSOF 26PIN(PLASTIC) 0.9 0.1 0.08 *5.6 0.05 A 26 14 S 5.5 4.2 (0.2) + 0.05 0.2 0 0.4 (1.5) (0.7) ...
Description	Power Amplifier/Antenna Switch Low Noise Down Conversion Mixer for PHS
File Size	123.94K / 8 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXG1053FN
OCR Text	...ODE JEDEC CODE HSOF-26P-01 LEAD treatment LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.06g -8- (0.2) + 0.05 0.2 0 0.4 (1.75) 0.45 0.15
Description	Power Amplifier/Antenna Switch Low Noise Amplifier/Down Conversion Mixer for PHS
File Size	132.23K / 8 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL1517N CXL1518N CXL1517
OCR Text	...SOP-24P-L01 SSOP024-P-0056 LEAD treatment LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM PLATING 42/COPPER ALLOY 0.1g -7- 0.5 0.2 7.6 0.2
Description	CMOS-CCD Signal Processor
File Size	100.52K / 7 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL1517 CXL1517M CXL1518M
OCR Text	... SOP-20P-L01 SOP020-P-0300 LEAD treatment LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.3g -7- 0.5 0.2 1 0.45 0.1 10 6.9 + 0.1 0.2 - 0.05
Description	From old datasheet system CMOS-CCD Signal Processor
File Size	96.84K / 7 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL5512M CXL5512P
OCR Text	...SOP-8P-L03 SOP008-P-0225-A LEAD treatment LEAD MATERIAL PACKAGE WEIGHT EPOXY / PHENOL RESIN SOLDER PLATING 42 ALLOY 0.1g CXL5512P 8PIN DIP (PLASTIC) 300mil 0.5 0.2 8 5 7.62 + 0.3 6.4 - 0.1 + 0.4 9.4 - 0.1 + 0.1 0...
Description	CMOS-CCD 1H Delay Line for NTSC
File Size	156.65K / 9 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL5513M CXL5513P
OCR Text	...SOP-8P-L03 SOP008-P-0225-A LEAD treatment LEAD MATERIAL PACKAGE WEIGHT EPOXY / PHENOL RESIN SOLDER PLATING 42 ALLOY 0.1g CXL5513P 8PIN DIP (PLASTIC) 300mil 0.5 0.2 8 5 7.62 + 0.3 6.4 - 0.1 + 0.4 9.4 - 0.1 + 0.1 0...
Description	CMOS-CCD 1H Delay Line for NTSC
File Size	152.61K / 9 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL5514M CXL5514P
OCR Text	...SOP-8P-L03 SOP008-P-0225-A LEAD treatment LEAD MATERIAL PACKAGE WEIGHT EPOXY / PHENOL RESIN SOLDER PLATING 42 ALLOY 0.1g CXL5514P 8PIN DIP (PLASTIC) 300mil 0.5 0.2 8 5 7.62 + 0.3 6.4 - 0.1 + 0.4 9.4 - 0.1 + 0.1 0...
Description	CMOS-CCD 1H Delay Line for PAL
File Size	142.57K / 9 Page	View it Online	Download Datasheet

For treatment Found Datasheets File :: 5486 Search Time::1.406ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |