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  15015-0423 Datasheet PDF File

For 15015-0423 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    ATS015015016-SF-4O

Advanced Thermal Solutions, Inc.
Part No. ATS015015016-SF-4O
Description 15.00 x 15.00 x 16.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.11K  /  1 Page

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Amphenol Communications Solutions

Part No. 10085901-5015EHLF
Description 0.50mm Flex Connector, VHC Series, 50 Position, Bottom Side Contact, Side Entry Surface Mount ZIF Connector, Halogen Free, Lead Free Type.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    ATS015015010-PF-4I

Advanced Thermal Solutions, Inc.
Part No. ATS015015010-PF-4I
Description 15.00 x 15.00 x 10.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin FIn

File Size 250.03K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-111501500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    MJ2955A 2N3055A MJ15016 MJ15015

Mospec Semiconductor, Corp.
MOSPEC[Mospec Semiconductor]
Part No. MJ2955A 2N3055A MJ15016 MJ15015
Description POWER TRANSISTORS(15A) 功率晶体管(15A条)

File Size 193.19K  /  4 Page

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Amphenol Communications Solutions

Part No. MUSB2K15015BP
Description Rugged USB Micro AB Interface Accessory, Input Output Connector, Dust Cover, Black color.
Tech specs    

Official Product Page

    ATS015015011-SF-4J

Advanced Thermal Solutions, Inc.
Part No. ATS015015011-SF-4J
Description 15.00 x 15.00 x 11.00 BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.05K  /  1 Page

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Amphenol Communications Solutions

Part No. 68604-232HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS015015010-MF-4I

Advanced Thermal Solutions, Inc.
Part No. ATS015015010-MF-4I
Description 15.00 x 15.00 x 10.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.92K  /  1 Page

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Amphenol Communications Solutions

Part No. 69190-423HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 23 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS015015011-PF-4J

Advanced Thermal Solutions, Inc.
Part No. ATS015015011-PF-4J
Description 15.00 x 15.00 x 11.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin

File Size 250.00K  /  1 Page

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Amphenol Communications Solutions

Part No. 78290-423HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    DTA124EKA A5800423

ROHM
Part No. DTA124EKA A5800423
Description Digital transistors (built-in resistors)
From old datasheet system

File Size 69.19K  /  3 Page

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Amphenol Communications Solutions

Part No. 68004-230HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    TC4093BF TC4093BFN TC4093BP E004237

TOSHIBA[Toshiba Semiconductor]
Part No. TC4093BF TC4093BFN TC4093BP E004237
Description From old datasheet system
QUAD 2-INPUT NAND SCHMITT TRIGGERS

File Size 220.47K  /  5 Page

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Amphenol Communications Solutions

Part No. 68004-235HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    TC4094BF TC4094BFN TC4094BP E004239

TOSHIBA[Toshiba Semiconductor]
Part No. TC4094BF TC4094BFN TC4094BP E004239
Description From old datasheet system
8-STAGE SHIFT - AND - STORE BUSREGISTE

File Size 351.71K  /  8 Page

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Amphenol Communications Solutions

Part No. 68604-231HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    M/A-COM Technology Solu...
Part No. MADP-042505-130600 MADP-042905-130600 MADP-042405-130600 MADP-042305-130600
Description Polymer Scratch Protection

File Size 663.91K  /  5 Page

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Amphenol Communications Solutions

Part No. 68004-231HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

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