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FILTRONIC[Filtronic Compound Semiconductors]
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| Part No. |
LP6836
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| OCR Text |
...easures can be found in MIL-STD-1686 and MIL-HDBK-263. ASSEMBLY INSTRUCTIONS The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is one minute... |
| Description |
MEDIUM POWER PHEMT
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| File Size |
34.29K /
2 Page |
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it Online |
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Agilent Technologies
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| Part No. |
HSMN-C110 HSMN-C150 HSMN-C170 HSMN-C190 HSMN-C191
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| OCR Text |
...ass 1 ESD sensitive per MIL-STD-1686. Please observe appropriate precautions during handling and processing. Refer to Agilent Technologies A...3.2 (0.126 ) CLEAR EPOXY
DIFFUSED EPOXY
1.5 (0.059)
1.4 (0.055)
POLARITY
0.3 (0.012) PC... |
| Description |
(HSMx-C110/170/190/191/150) SMT Chip LED
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| File Size |
262.82K /
8 Page |
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it Online |
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MOTOROLA[Motorola, Inc]
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| Part No. |
MHW9227 MHW9227D
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| OCR Text |
... Human Body Model per Mil. Std. 1686 Input Value 200 2 Output Value 200 2 Unit V kV
ELECTRICAL CHARACTERISTICS (VCC = 24 Vdc, TC = +45C, ...3
Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
A Z
A S B V
2X
Q 0.010
M
TF
... |
| Description |
GALLIUM ARSENIDE CATV AMPLIFIER MODULE
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| File Size |
268.56K /
4 Page |
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it Online |
Download Datasheet |
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M/A-COM Technology Solu...
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| Part No. |
MAAM26100-15
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| OCR Text |
...ould comply with dod - std - 1686 class i. c. transients - avoid instrument and power sup- ply transients while bias is c...3 seconds of scrub- bing should be required for attachment. bonding a. ball or wedge bon... |
| Description |
GaAs MMIC Power Amplifier
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| File Size |
768.29K /
6 Page |
View
it Online |
Download Datasheet |
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