1809 pdf Datasheet P9 Part Num --- IC-ON-LINE


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1809 Datasheet PDF File

For 1809 Found Datasheets File :: 145+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |

					SAMSUNG[Samsung semiconductor]
Part No.	K7A803609A K7A801809A
Description	256Kx36 & 512Kx18 Synchronous SRAM
File Size	363.62K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-809282000LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Samsung semiconductor
Part No.	K7N801809B K7N803609B
Description	256Kx36 & 512Kx18 Pipelined NtRAM
File Size	394.30K / 19 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-809071800LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					ON Semiconductor
Part No.	NBXDPA0180910 NBXDPA018
Description	Crystal Oscillator Module, 2.5 V / 3.3 V, 155.52 MHz / 311.04 MHz PureEdge™ 2.5 V / 3.3 V, 155.52 MHz / 311.04MHz LVDS Clock Oscillator 2.5 V / 3.3 V, 155.52 MHz / 311.04MHz LVDS Clock Oscillator
File Size	122.75K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-118-09LF
Description	BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions
Tech specs				Official Product Page

					Cypress Semiconductor
Part No.	CY62137FV1809
Description	2-Mbit (128K x 16) Static RAM
File Size	392.15K / 11 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-418-09LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

					Cypress Semiconductor
Part No.	CY62157EV1809
Description	8-Mbit (512K x 16) Static RAM
File Size	412.26K / 12 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-809161550LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Tyco Electronics
Part No.	160914-1 480053-3 480053-4 480053-5 480054-3 480054-5 180907-0 180907-5 180908-0 180908-5 180923-0 180923-5 180924-0 1-180907-0 521743-1 180351-8 4-180924-0
Description	Multiple Circuit Housings with Tabs & Receptacles Including FASTIN-FASTON; FF STECKH 6,3 RAD ( AMP ) FASTIN-FASTON Product Line
File Size	651.54K / 15 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-105180950LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page


Part No.	K7A401809A-TC18 K7A403609A-TC18 K7A403609A-TC22
Description	256K X 18 CACHE SRAM, 3 ns, PQFP100 128K X 36 CACHE SRAM, 3 ns, PQFP100 128K X 36 CACHE SRAM, 2.6 ns, PQFP100
File Size	467.44K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54111-809201800LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Freescale (Motorola)
Part No.	MRF18090BR3 MRF18090BSR3
Description	1.90–1.99 GHz, 90 W, 26 V Lateral N–Channel RF Power MOSFET
File Size	551.78K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-809081450LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Motorola, Inc Freescale Semiconductor, Inc
Part No.	MRF18090BR3 MRF18090BSR3
Description	RF Power Field Effect Transistors N-Channel Enhancement-Mode Lateral MOSFETs
File Size	383.41K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-818-09LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K7A403609A K7A401809A K7A403609B
Description	256K x 18-Bit Synchronous Pipelined Burst SRAM Data Sheet 128K x 36-Bit Synchronous Pipelined Burst SRAM Data Sheet 128Kx36 & 256Kx18-Bit Synchronous Pipelined Burst SRAM 128Kx36/x32 & 256Kx18 Synchronous SRAM
File Size	461.50K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-809201800LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

For 1809 Found Datasheets File :: 145+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |

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