| |
|
 |
Renesas Electronics Corporation
|
| Part No. |
M6MGD137W34DWG
|
| OCR Text |
... FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM
Description
The M6MGD137W34DWG is a Stacked Chip Scale Package...80mm Outer-ball:Su-Ag-Cu
Application
Mobile communication products
PIN CONFIGURATION (TOP VIE... |
| Description |
134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM
|
| File Size |
119.45K /
3 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Fujitsu
|
| Part No. |
MB86S02
|
| OCR Text |
... RGB mosaic (with micro lens) : 2.8V (single voltage) : 30mW (fOSCIN=9MHz, fPCLK=4.5MHz, 15 fps) : 9MHz standard : CMOS level : CMOS level (...80mm x 6.98mm x 4.31mm) : Cellular phones, PDA camera
t a .D
S a
e h
U t4 e
.c
m o... |
| Description |
CIF CMOS Sensor Camera Module
|
| File Size |
727.79K /
25 Page |
View
it Online |
Download Datasheet |
| |
|
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| Part No. |
BCC BCCS__ BCC_ BCC__ BCCS_
|
| OCR Text |
...sure Cooker Test JEDEC Level 2a/2/1@260C (depending upon package) -65C/150C, 1000 cycles 150C, 1000 hrs 85C/85% RH, 1000 cycles 121C, 100% RH, 2 atm, 168 hrs
PACKAGE CONFIGURATIONS
Package Size (mm)
4 5 6 7 8 9 x x x x x x 4 5 6 7 8 9
... |
| Description |
Bump Chip Carrier
|
| File Size |
585.29K /
2 Page |
View
it Online |
Download Datasheet |
| |
|
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| Part No. |
LFBGA-H FBGA
|
| OCR Text |
...ate based package which enables 2 and 4 layers of routing flexibility
FEATURES
* Thin, lightweight, space saving package * Flexible body...80mm) and UFBGA (0.55mm max.) thickness. LFBGA-H (with attached heatsink) is qualified for small bod... |
| Description |
Fine Pitch Ball Grid Array
|
| File Size |
555.50K /
2 Page |
View
it Online |
Download Datasheet |
| |
|
|
List of Unclassifed Manufac...
ETC[ETC]
N.A.
|
| Part No. |
TP337 TP337E TP337A
|
| OCR Text |
... 0.48 100 ---
m K V/W cm*Hz1/2/W ms nV/Hz1/2 nW/Hz1/2
Operation
-20
25
29.1 3773
30.0 3811
30.9 3849
K K
Tempera...80mm (diameter)
337E
Thermopile Infrared Sensor
Thermistor vs. temperature
TP337
The res... |
| Description |
Thermopile Infrared Sensor
|
| File Size |
211.34K /
9 Page |
View
it Online |
Download Datasheet |
| |
|
|
Renesas Electronics, Corp.
Renesas Electronics Corporation
|
| Part No. |
M6MGD13TW66CWG-P
|
| OCR Text |
...(Max.) 85ns /25ns (Max.) FM-VCC=2.7 ~ 3.0V Ta= -40 ~ 85 degree 72pin S-CSP, Ball pitch 0.80mm Outer-ball:Sn-Pb
Ambient Temperature 64M-bit Mobile RAM is a 4,194,304 words high density RAM Package fabricated by CMOS technology for the per... |
| Description |
134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 67,108,864-BIT (4,194,304-WORD BY 16-BIT) CMOS MOBILE RAM 134217728位（8388608字由16位）的CMOS闪存
134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 67,108,864-BIT (4,194,304-WORD BY 16-BIT) CMOS MOBILE RAM
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
| File Size |
119.78K /
3 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
