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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TLP3122A
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| Description |
Photorelay (MOSFET output, 1-form-a), 60 V/1.4 A, 3750 Vrms, 4pin SO6
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137785-031222LF
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| Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131931-221ULF
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| Description |
Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 21 Positions, 2mm (0.079inch), horizontal.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
85003-3122 0850033122
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| Description |
2.54mm (.100") Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole0.60渭m (24渭") Selective Gold (Au) Plating, 64 Circuits, without Mounting Clips, No
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole0.60μm (24μ) Selective Gold (Au) Plating, 64 Circuits, without Mounting Clips, No FluxProof
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| File Size |
60.34K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
G832MB010403122HR
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| Description |
0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold Black.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68033-122HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0878312228 87831-2228
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 22 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot
2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 22 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot
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| File Size |
189.25K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-122-18LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 18 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-122-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68023-122HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54mm Pitch, RightAngle, 3.42mm (0.135in) Mating, 7.75mm (0.305in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-122-32LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 32 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-122-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 3122V |
| Maker: N/A |
| Pack: TO-3P |
| Stock: 615 |
| Unit price
for : |
|
50: $0.92 |
|
100: $0.88 |
| 1000:
$0.83 |
|
Email: oulindz@gmail.com |
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