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Part No. |
19720
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Description |
Microprocessor Family BIOS Development Guide Application Note 117KB (PDF) 微处理器家族的BIOS开发指南应用笔记? 117KBPDF格式
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File Size |
123.76K /
33 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
L77DD50SAM4B
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Description |
Dsub, Machined signal 7.5A, Right Angle PCB Thru Hole, FP=14.84mm, Cnt Tail 0.6mm, 50 Socket, Bright Tin Shell, Flash Gold, 3.1mm (0.122 in) Clear Hole, Metal R/A Bracket Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177DFDG50SAJ4
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Description |
Dsub, Machined signal 7.5A, Right Angle PCB Thru Hole, FP=8.10mm, Cnt Tail 0.6mm, 50 Socket, Bright Tin Shell, 0.76um (30u\\) Gold, M3 Threaded Rear Insert, Plastic RighAngle Bracket Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177DFD50SAJ3VFM
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Description |
Dsub, Machined signal 7.5A, Right Angle PCB Thru Hole, FP=8.10mm, Cnt Tail 1.02mm, 50 Socket, Bright Tin Shell, 0.76um (30u\\) Gold, M3 Fixed Round Front Screwlock, Plastic R/A Bracket Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177DFDH50SAM4
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Description |
Dsub, Machined signal 7.5A, Right Angle PCB Thru Hole, FP=8.10mm, Cnt Tail 0.6mm, 50 Socket, Bright Tin Shell, 0.76um (30u\\) Gold, 4-40 Threaded Rear Insert, Metal R/A Bracket (Length 13.2mm)Without Boardlock
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Tech specs |
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Official Product Page
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Price and Availability
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