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  75757-5161 Datasheet PDF File

For 75757-5161 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    0757576441 75757-6441

Molex Electronics Ltd.
http://
Part No. 0757576441 75757-6441
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 51617-XX002LF
Description PwrBlade®, Power Supply Connectors, 5P 24S 1M 7P PF Vertical Receptacle.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0757576321 75757-6321

Molex Electronics Ltd.
Part No. 0757576321 75757-6321
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 84516-102
Description 200 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    0757576431 75757-6431

Molex Electronics Ltd.
Part No. 0757576431 75757-6431
Description 3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.5um (60u") Tin (Sn) Plating
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.5um (60u) Tin (Sn) Plating

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-3516-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0757576401 75757-6401

Molex Electronics Ltd.
Part No. 0757576401 75757-6401
Description 3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.5um (60u") Tin (Sn) Plating
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.5um (60u) Tin (Sn) Plating

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8516-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0757576421 7575-76421

Molex Electronics Ltd.
Part No. 0757576421 7575-76421
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.5μm (60μ)Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-7516-11H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0757570461

Molex Electronics Ltd.
Part No. 0757570461
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall

File Size 99.23K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-516122300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-0341 0757570341

Molex Electronics Ltd.
Part No. 75757-0341 0757570341
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-7516-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-0242 0757570242

Molex Electronics Ltd.
Part No. 75757-0242 0757570242
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6516-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    75757-0231 0757570231

Molex Electronics Ltd.
Part No. 75757-0231 0757570231
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. F516-1A7H1-21014
Description Flex Connector, 1.00mm Pitch, Height 2.00mm, Right angle, Flip type, ZIF, 14 position, With MYLAR
Tech specs    

Official Product Page

    75757-0321 0757570321

Molex Electronics Ltd.
Part No. 75757-0321 0757570321
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25um (50u) Nickel (Ni) Overall

File Size 98.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137925-1612LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 16 Positions, Non GW Compatible LCP, Tape and Reel. .
Tech specs    

Official Product Page

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