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Iterra
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| Part No. |
ITR39100
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| OCR Text |
...nt to prevent contamination of bonding surfaces . these are esd sensitive devices and should be handled with appropriate precaution including the use of wrist-grounding straps. all die attach and wire/ribbon bond equipment must be wel... |
| Description |
power amplifier MMIC
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| File Size |
438.54K /
7 Page |
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it Online |
Download Datasheet
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Vishay Sfernice
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| Part No. |
TA33-10KD10KD0016
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| OCR Text |
...t power handling capacity. two bonding pads pe r termination allow greater flexibility in hybrid layout design. features ? center tap feature ? resistor material: self-passivating ? tantalum nitride ? silicon substrate for good power dis... |
| Description |
TA 33 Wirebondable Dual Value Thin Film Chip Resistor Networks, Center Tap
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| File Size |
73.02K /
3 Page |
View
it Online |
Download Datasheet
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Price and Availability
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