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  glass-encapsulated Datasheet PDF File

For glass-encapsulated Found Datasheets File :: 645    Search Time::0.719ms    
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    MA4SW610B-1

M/A-COM Technology Solutions, Inc.
Part No. MA4SW610B-1
OCR Text ... ? reliable. fully monolithic, glass encapsulated construction description the ma4sw610b-1 is a reflective sp6t series shunt broad band switch with integrated bias networks made with m/a-com?s hmic tm (heterolithic microwave int ...
Description SP6T PIN Diode Switch with Integrated Bias Network 2 - 18GHz

File Size 106.92K  /  6 Page

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    MACOM[Tyco Electronics]
Part No. MA4SPS502
OCR Text ...rebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Indu...encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These ...
Description Surface Mount Monolithic PIN Diode Chip

File Size 125.84K  /  3 Page

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    MACOM[Tyco Electronics]
Part No. MA4SPS502_1 MA4SPS5021
OCR Text Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Effi...encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These ...
Description SURMOUNT PIN Diode

File Size 140.90K  /  4 Page

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    MACOM[Tyco Electronics]
Part No. MA4SPS422 MA4SPS42 MA4SPS420
OCR Text ...rebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Indu...encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protect...
Description SURMOUNT PIN Diodes

File Size 206.90K  /  7 Page

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    MACOM[Tyco Electronics]
Part No. MA4SPS402
OCR Text ...rebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Indu...encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These ...
Description Surface Mount Monolithic PIN Diode Chip

File Size 48.88K  /  3 Page

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    MACOM[Tyco Electronics]
Part No. MA4SPS402_1 MA4SPS402 MA4SPS4021
OCR Text Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Effi...encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protect...
Description SURMOUNT PIN Diode

File Size 212.34K  /  7 Page

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    MACOM[Tyco Electronics]
Part No. MA4PBL027
OCR Text Glass Construction Silicon Nitride Passivation Polymer Scratch and Impact Protection Low Parasitic Capacitance and Inductance Ultra Low Capa...encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protect...
Description HMICTM Silicon Beam-Lead PIN Diodes

File Size 309.36K  /  5 Page

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    MACOM[Tyco Electronics]
Part No. MA4BN1840-2
OCR Text ...ation Rugged, Fully Monolithic, Glass Encapsulated Construction Description The MA4BN1840-2 device is a fully monolithic broadband bias network utilizing M/A-COM's HMIC TM (Heterolithic Microwave Integrated Circuit) Process, US Patent 5...
Description Monolithic HMIC Integrated Dual Bias Network 18 - 40 GHz

File Size 174.51K  /  8 Page

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    PMLL4148L PMLL4448

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. PMLL4148L PMLL4448
OCR Text ...ed in small hermetically sealed glass SOD80C SMD packages. Table 1: Product overview Package Philips PMLL4148L PMLL4448 SOD80C SOD80C JEITA single diode single diode Configuration Type number 1.2 Features s s s s s Small hermeticall...
Description High-speed switching diodes

File Size 56.09K  /  11 Page

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    MACOM[Tyco Electronics]
Part No. MA4BN1840-1
OCR Text ...ation Rugged, Fully Monolithic, Glass Encapsulated Construction Description The MA4BN1840-1 device is a fully monolithic broadband bias network utilizing M/A-COM's HMIC TM (Heterolithic Microwave Integrated Circuit) Process, US Patent 5...
Description Monolithic HMIC Integrated Bias Network 18 - 40 GHz

File Size 178.30K  /  9 Page

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