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Avago Technologies, Ltd.
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| Part No. |
HSDL-3003-001
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| Description |
IrDAData Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver 红外线㈢数据兼容低功115.2 kbit / s的红外遥控器
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| File Size |
448.05K /
21 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54121-816142500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Agilent (Hewlett-Packard)
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| Part No. |
HSDL-3603-007
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| Description |
HSDL-3603-007 · IrDA 1.4 Data Compliant 4Mb/s 3-5V Infrared Transceiver (Not Recommended for New Designs)
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| File Size |
374.51K /
29 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-112042500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 4 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
U10A474250T
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| Description |
SlimSAS Right angle X8 30u\\ Gold plating, Latch pin length=3.0mm, 24G, T&R packing
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
U10KH7425001T
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| Description |
SlimSAS Vertical X12 30u\\ Gold plating, Latch pin outside, Latch pin length=3.0mm, 24G, T&R packing
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77315-425-04LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61124-250CACLF
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| Description |
Assembly, Top Mount, D/D(136Pins), VTB, Type 123, 3.3V, 5mm s/o, Right Push Rod Eject, 9.5mm Eject Travel
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-112142500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-811242500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Optoway Technology, Inc.
Agilent (Hewlett-Packard)
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| Part No. |
HSDL-3203-021
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| Description |
IrDA 1.4 Data Compliant 115.2Kb/s 3V Infrared Transceiver 红外1.4数据符合115.2Kb / sV的红外收发器
HSDL-3203-021 · IrDA 1.4 Data Compliant 115.2Kb/s 3V Infrared Transceiver
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| File Size |
275.11K /
19 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54242-504140950LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59112-G24-25-051LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: HSDL-4251 |
| Maker: |
| Pack: |
| Stock: |
| Unit price
for : |
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50: $0.34 |
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100: $0.32 |
| 1000:
$0.31 |
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Email: oulindz@gmail.com |
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Contact us |
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