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				Infineon
Part No.	LYE675-T2V1-11
OCR Text	... voltage, wavelength * assembly methods: suitable for all SMT assembly methods * soldering methods: IR reflow soldering and TTW soldering * preconditioning: acc. to JEDEC Level 2 * taping: 8 mm tape with 2000/reel, o180 mm or 8000/reel, o33...
Description	Power TOPLED
File Size	136.13K / 14 Page	View it Online	Download Datasheet

				Panasonic Semiconductor
Part No.	DMS935E2
OCR Text	...V mV MHz Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Pulse measurement CCD load device Parameter Pinchi off current Output impedance Symbol IP ZO Condition...
Description	Silicon NPN epitaxial planar type
File Size	515.02K / 5 Page	View it Online	Download Datasheet

				Osram Opto Semiconductors
Part No.	LOM67K
OCR Text	...tensity, wavelength assembly methods: suitable for all smt assembly methods soldering methods: ir reflow soldering and ttw soldering preconditioning: acc. to jedec level 2 taping: 8-mm tape with 3000/reel, ? 180 mm or 12000...
Description	Hyper Mini TOPLED
File Size	178.53K / 14 Page	View it Online	Download Datasheet

				Panasonic Semiconductor
Part No.	DMS935E1
OCR Text	...V mV MHz Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Pulse measurement CCD load device Parameter Pinchi off current Output impedance Symbol IP ZO Condition...
Description	Silicon NPN epitaxial planar type
File Size	514.54K / 5 Page	View it Online	Download Datasheet

				DYNEX[Dynex Semiconductor]
Part No.	DF25216 DF25210 DF25212 DF25214 DF25208 DF252 DF25206
OCR Text	...omers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operati...
Description	Fast Recovery Diode
File Size	57.98K / 8 Page	View it Online	Download Datasheet

				DYNEX[Dynex Semiconductor]
Part No.	DF45216 DF45208 DF452 DF45206 DF45210 DF45212 DF45214
OCR Text	...omers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operati...
Description	Fast Recovery Diode
File Size	59.69K / 7 Page	View it Online	Download Datasheet

				Osram Opto Semiconductors GmbH
Part No.	LOL29K-J2L1-24 LOL29K-H2L1-24
OCR Text	...ntensity, wavelength * assembly methods: suitable for all SMT assembly methods * soldering methods: IR reflow soldering and TTW soldering * preconditioning: acc. to JEDEC Level 2 * taping: 8 mm tape with 5000/reel resp. 10000/reel, o180 mm ...
Description	SmartLED0603 Hyper-Bright Low Current LED Lead (Pb) Free Product - RoHS Compliant
File Size	229.90K / 14 Page	View it Online	Download Datasheet

For methods. Found Datasheets File :: 29391 Search Time::1.5ms
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