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Amphenol Communications Solutions |
Part No. |
131-6116-11D
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Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
131-6116-11H
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Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
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Tech specs |
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Official Product Page
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Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)]
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Part No. |
MGA-53543
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Description |
MGA-53543 · 5V High Linearity LNA, 39dBm OIP3, 0.45-6GHz, SOT343(SC-70) 50 MHz to 6 GHz High Linear Amplifier
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File Size |
177.58K /
14 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
131-6116-21H
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Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87916-116HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68016-116HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100) Pitch.
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
131-6116-21D
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Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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Tech specs |
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Official Product Page
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Price and Availability
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