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  TDL3-0513 Datasheet PDF File

For TDL3-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    51336-0610 0513360610

Molex Electronics Ltd.
Part No. 51336-0610 0513360610
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 6Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 6Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 6Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 68405-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    51336-0710 0513360710

Molex Electronics Ltd.
Part No. 51336-0710 0513360710
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 7Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 7Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 68705-131HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51353-2400 0513532400

Molex Electronics Ltd.
Part No. 51353-2400 0513532400
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockDual Row, 24 circuits

File Size 242.32K  /  3 Page

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Amphenol Communications Solutions

Part No. U95Z2454051301
Description ULTQSFP 2X2 COMBO 4LP&SPFG
Tech specs    

Official Product Page

    51336-0910 0513360910

Molex Electronics Ltd.
Part No. 51336-0910 0513360910
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 9Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 9Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 9Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 98426-G04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    51336-1010 0513361010

Molex Electronics Ltd.
Part No. 51336-1010 0513361010
Description 1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 10 Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 10 Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 73305-131LF
Description RJ45 Modular Jack, Input Output Connectors, CAT 3, Standard, 6P6C, Right Angle, Surface Mount, without Shield, 1 Port.
Tech specs    

Official Product Page

    51336-1110 0513361110

Molex Electronics Ltd.
Part No. 51336-1110 0513361110
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 11Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 11Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 11Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-807051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51336-1210 0513361210

Molex Electronics Ltd.
Part No. 51336-1210 0513361210
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 12Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 12Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 12Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. DDR4288S0513VF
Description DDR4 Memory Module Sockets, Storage and Server System, Surface Mount, 288 Position, 0.85mm (0.0335in) pitch.
Tech specs    

Official Product Page

    51336-1510 0513361510

Molex Electronics Ltd.
Part No. 51336-1510 0513361510
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 15Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 15Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 68705-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51336-1710 0513361710

Molex Electronics Ltd.
Part No. 51336-1710 0513361710
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 17Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-407051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51353-2000 0513532000

Molex Electronics Ltd.
Part No. 51353-2000 0513532000
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock Dual Row, 20 circuits

File Size 242.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 10120513-002C-TRLF
Description SAS/PCIe 3.0 (U.2) Connectors, Storage and Server Connector, 68 Position Vertical Recep SMT, 12Gb/s.
Tech specs    

Official Product Page

For TDL3-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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