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Part No. |
AN-9037
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OCR Text |
...llent thermal performance with large thermal pads in the center of the package which solder directl y to the printed wiring board (pwb) a...area ratio for paste release prediction: t w l w l walls aperture of area pad of area ratio area... |
Description |
8x8 MLP DriverMOS Packaging
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File Size |
749.51K /
7 Page |
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it Online |
Download Datasheet
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http://
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Part No. |
AN-9040
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OCR Text |
...e. this is largely due to the large thermal pad in the center of the package which solder directly to the printed wiring board (pwb) and...area ratio for paste release prediction: t w l w l walls aperture of area pad of area ratio area... |
Description |
Power33 Packaging
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File Size |
299.73K /
7 Page |
View
it Online |
Download Datasheet
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http://
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Part No. |
AN-9046
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OCR Text |
...le nt thermal performance with large thermal pads in the center of the package which solder directly to the printed wiring board (pwb). ...area ratio for paste release prediction: t w l w l walls aperture of area pad of area ratio area ... |
Description |
Dual Power56 Packaging
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File Size |
850.15K /
10 Page |
View
it Online |
Download Datasheet
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http://
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Part No. |
AN-9048
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OCR Text |
...llent thermal performance with large thermal pads in the center of the package which solder directl y to the printed wiring board (pwb) a...area ratio for paste release prediction: t w l w l walls aperture of area pad of area ratio area... |
Description |
6x6 DriverMOS Packaging
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File Size |
746.79K /
9 Page |
View
it Online |
Download Datasheet
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Price and Availability
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