|
|
|
Microtips Technology, Inc. Amphenol, Corp. TE Connectivity, Ltd.
|
Part No. |
PUMA67E4007AM-25 PUMA67E4007AM-25E PUMA67E4007-20 PUMA67E4007AI-25 PUMA67E4007AI-25E PUMA67E4007AM-17 PUMA67E4007AM-17E PUMA67E4007MB-17E PUMA67E4007AMB-17E PUMA67E4007M-17E PUMA67E4007A-17E PUMA67E4007AI-17E PUMA67E4007I-17E PUMA67E4007-17E PUMA67E4007I-25E PUMA67E4007I-15 PUMA67E4007I-20E PUMA67E4007I-15E PUMA67E4007AMB-15E PUMA67E4007AMB-25E PUMA67E4007-15E PUMA67E4007MB-15 PUMA67E4007AM-15 PUMA67E4007AI-20E PUMA67E4007A-15
|
Description |
x32 EEPROM Module 150NS, TSOP, IND TEMP(EEPROM) 150NS, PDIP, IND TEMP(EEPROM) 150NS, FLATPACK, 883C; LEV B CMPLNT(EEPROM) 150NS, PLCC, COM TEMP(EEPROM) 200NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM) 150NS, 44LCC, 883C; LEV B COMPLIANT(EEPROM) 350NS,PGA,883C; LEVEL B FULLY COMPLIANT(EEPROM) 150NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM) 250NS, 32LCC, 883C; LEV B COMPLIANT(EEPROM) 250NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM) 150NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM) 250NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM) 120NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM) 150NS, PLCC, AUTO TEMP(EEPROM) X32号的EEPROM模块 150NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM) X32号的EEPROM模块 200NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM) X32号的EEPROM模块 DIE(EEPROM) X32号的EEPROM模块 200NS, PDIP, IND TEMP(EEPROM)
|
File Size |
707.53K /
13 Page |
View
it Online |
Download Datasheet |
|
|
|
Honeywell International, Inc.
|
Part No. |
AM-427-1A AM-427-2B AM-427-1B
|
Description |
200NS, 32LCC, 883C; LEV B COMPLIANT(EEPROM) 250NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM) 200NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM) 250NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM) 电压反馈运算放大
|
File Size |
171.08K /
4 Page |
View
it Online |
Download Datasheet |
|
|
|
NXP Semiconductors N.V.
|
Part No. |
PUMA67F16000I-25 PUMA67F16000M-15 PUMA67F16000M-20 PUMA67F16000I-15 PUMA67F16000MB-25 PUMA67F16000-25 PUMA67F16000-15
|
Description |
200NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM) 250NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM) 250NS, PGA,883C; LEVEL B FULLY COMPLIANT(EEPROM) 200NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM) 150NS, PDIP, IND TEMP(EEPROM) 150NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM) 250NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM) X32号,闪存EEPROM模块 x32 Flash EEPROM Module X32号,闪存EEPROM模块
|
File Size |
843.75K /
16 Page |
View
it Online |
Download Datasheet |
|
|
|
Harwin PLC
|
Part No. |
D2864-01 D2808-21 D2824-21 D2922-01 D2808-01 D2818-01 D2820-01 D2832-21
|
Description |
2.54mm pitch dual row PC Tail ic Socket Assembly, gold clip tin/lead shell, 64-way DIP24, ic SOCKET 2.54mm pitch dual row PC Tail ic Socket Assembly, gold-flash clip tin/lead shell, 8-way DIP48, ic SOCKET 2.54mm pitch dual row PC Tail ic Socket Assembly, gold-flash clip tin/lead shell, 24-way DIP24, ic SOCKET 2.54mm pitch dual row PC Tail ic Socket Assembly, gold clip tin/lead shell, 22-way DIP22, ic SOCKET 2.54mm pitch dual row PC Tail ic Socket Assembly, gold clip tin/lead shell, 8-way DIP48, ic SOCKET 2.54mm pitch dual row PC Tail ic Socket Assembly, gold clip tin/lead shell, 18-way DIP18, ic SOCKET 2.54mm pitch dual row PC Tail ic Socket Assembly, gold clip tin/lead shell, 20-way DIP40, ic SOCKET 2.54mm pitch dual row PC Tail ic Socket Assembly, gold-flash clip tin/lead shell, 32-way DIP32, ic SOCKET
|
File Size |
204.26K /
1 Page |
View
it Online |
Download Datasheet |
|
|
|
Molex Electronics Ltd.
|
Part No. |
0741620040 74162-0040 74162-1030
|
Description |
2.54mm (.100) pitch C-Grid? Receptacle, Right Angle, Through Hole, dual row,Shrouded, Version B, High-Temperature, 30 Circuits, Tin (Sn) 2.54mm (.100) pitch C-Grid Receptacle, Right Angle, Through Hole, dual row, Shrouded MOLEX Connector
|
File Size |
1,304.67K /
10 Page |
View
it Online |
Download Datasheet |
|
|
|
Molex Electronics Ltd.
|
Part No. |
70280-0068 A-70280-0068 0010897562 010-89-7562
|
Description |
2.54mm (.100) pitch C-Grid? Breakaway Header, dual row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") pitch C-Grid庐 Breakaway Header, dual row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating 2.54mm (.100") pitch C-Grid垄莽 Breakaway Header, dual row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
File Size |
421.87K /
4 Page |
View
it Online |
Download Datasheet |
|
|
|
Molex Electronics Ltd.
|
Part No. |
87914-2815 0879142815
|
Description |
2.54mm (.100) pitch C-Grid? Header, Through Hole, dual row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) pitch C-Grid庐 Header, Through Hole, dual row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) pitch C-Grid垄莽 Header, Through Hole, dual row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
File Size |
3,777.37K /
48 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|