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w baked Datasheet PDF File

For w baked Found Datasheets File :: 685 Search Time::2.375ms
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				Toshiba Semiconductor
Part No.	TL19w01-w-T32
OCR Text	w(t32 2010-12-13 1 toshiba led lamps tl19w01-w(t32 surface-mount devices ? 3.1 (l) mm 3.8 (w) mm 0.65 (h) mm size ? high lumi...baked in taping with reel. after baking, use the baked device within 72 hours, but perform baking o...
Description	LED lamps
File Size	268.18K / 10 Page	View it Online	Download Datasheet

				Cree, Inc
Part No.	MLBAwT-H1-0000-000VE7 MLBAwT-H1-0000-000VE5 MLBAwT-U1-0000-000VE5 MLBAwT-A1-0000-000VE7 MLBAwT-A1-0000-000VE5 MLBAwT-A1-0000-000wE5 MLBAwT-U1-0000-000VE7 MLBAwT-A1-0000-000UEA MLBAwT-A1-0000-000w5113 MLBAwT-P1-0000-000VE5
OCR Text	...ributed lighting applications. w ith xlamp lighting- class reliability, a wide viewing angle, uniform light output, and industry-leading ...baked according to the baking conditions listed below. cree recommends keeping xlamp l e ds in their...
Description	XLamp ML-B LEDs ANSI-compatible sub-bins Electrically neutral thermal path
File Size	714.26K / 11 Page	View it Online	Download Datasheet

				Toshiba Corporation Toshiba, Corp.
Part No.	TMP91C824F TMP91CU10F TMP91C829F TMP91Cw11F TMP93PF76F TMP94C241F TMP94FU81F TMP91FY12AF TMP91Cw12AF TMP93Pw20AF TMP91Pw10F TMP91Pw12F TMP91CY22F TMP91C025F TOSHIBACORPORATION-TMP93CU76F
OCR Text	...r consumption of the product [ w ] ja: thermal resistance of the package [ c / w ] note 1: when operating the device outside the range tj...baked to remove the moisture prior to solder mounting. store the pack at 30 c / 90%rh. after open...
Description	CABLE 32-Bit Microcontroller Quality And Reliability Assurance / Handling Precautions 质量与可靠性保操作注意事项
File Size	379.24K / 48 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TMP93PF76F
OCR Text	...wer consumption of the product [w] ja: Thermal resistance of the package [C / w] Note 1: when operating the device outside the range T...baked to remove the moisture prior to solder mounting. z Store the pack at 30C / 90%RH. After openin...
Description	Quality And Reliability Assurance / Handling Precautions
File Size	368.69K / 47 Page	View it Online	Download Datasheet

				TOSHIBA[Toshiba Semiconductor]
Part No.	TMP93CF77F TMP95CS54F TMP96C141BF TMP91C016F TMP91C025F TMP91C219F TMP91C815F TMP91C824F TMP91C829F TMP91CU10F TMP91Cw11F TMP91Cw12AF TMP91Cw12F TMP91Cw18AF TMP91CY22F TMP91Pw10F TMP91Pw11F TMP91Pw12F TMP91Pw18AF TMP95C061BF TMP94C251AF TMP95CS64F TMP95CS66F TMP95Cw64F TMP95Cw65F TMP95Pw64F TMP95C265F TMP95PS54F TMP93CM40F TMP93CT76F TMP93PS40DF TMP93PS40F TMP93PS42AF TMP93PS44F TMP93CU44DF TMP93C071F TMP96PM40F TMP96CM40F TMP96C031ZF TMP93CS32F TMP93Cw40DF TMP93Cw41DF TMP93Cw44DF TMP93Cw46AF TMP93Cw76F TMP93CS20F TMP93CF76F TMP96C041BF TMP93Cw40D TMP94C241CF TMP95C063F TMP93CS45F TMP93Pw44ADF TMP95Fw54AF TMP93Pw20AF TMP93Pw40DF TMP93Pw46AF TMP95C001F TMP95CU54AF TMP95Cw54AF TMP95FY64F TMP93Pw32F TMP91FY22F TMP93Pw76F TMP91FY12AF TMP93CS40DF TMP93CS40F TMP93CS41DF TMP93CS41F TMP93CS42AF TMP93CS44F TMP93CU76F TMP94FU81F
OCR Text	...wer consumption of the product [w] ja: Thermal resistance of the package [C / w] Note 1: when operating the device outside the range T...baked to remove the moisture prior to solder mounting. z Store the pack at 30C / 90%RH. After openin...
Description	Quality And Reliability Assurance / Handling Precautions
File Size	369.80K / 48 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TLwJ1100
OCR Text	...ce-mount devices 3.2 (L) x 2.8 (w) x 1.9 (H) mm LED chip + phosphor Luminous intensity : Iv = 750 mcd (typ.) @20mA Color: white Chromaticity...baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking o...
Description	Panel Circuit Indicator
File Size	309.33K / 9 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TL21w02-LT34
OCR Text	...es * * * * * 2.1 (L) mm x 2.5 (w) mm x 0.65 (H ) mm size High luminous flux LED: 46 lm(typ.) @IF=150 mA Color: white (3000K) Reflow-solderi...baked in taping with reel. After baking, use the baked device within 72 hours, but perform baking on...
Description	LED lamps
File Size	241.70K / 9 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TLwF1109T11
OCR Text	w) mm 1.9 (h) mm ? led chip and phosphor ? luminous intensity: i v = 3200 mcd (typ.) @ i f = 40 ma ? color: white ? topr / tstg =...baked in taping with reel. after baking, use the baked device within 72 hours, but perform baking o...
Description	Panel Circuit Indicators
File Size	255.66K / 10 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TLwNF1100C
OCR Text	...ce-mount devices 3.2 (L) x 2.9 (w) x 1.9 (H) mm LED chip and phosphor Luminous intensity: Iv = 1600 mcd (typ.) @ 20 mA Color: white (Natural...baked in taping with reel. After baking, use the baked device within 72 hours, but perform baking on...
Description	LED Lamp
File Size	292.67K / 9 Page	View it Online	Download Datasheet

For w baked Found Datasheets File :: 685 Search Time::2.375ms
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