| PART |
Description |
Maker |
| PS7801-A-F3 PS7801 PS7801-A-F4 PS7801-1A |
LEAD FREE A6279 SOIC 邻舍4针超小型平引脚，低输出电通道光学耦合MOSFET
LEAD FREE A6279ELP-T WITH TAPE & REEL
LEAD FREE A6279ELW-T WITH TAPE & REEL
NECs 4-PIN ULTRA SMALL FLAT-LEAD, LOW OUTPUT CAPACITANCE 1-CH OPTICAL COUPLED MOSFET
NECs 4-PIN ULTRA SMALL FLAT-LEAD / LOW OUTPUT CAPACITANCE 1-CH OPTICAL COUPLED MOSFET
NECs 4-PIN ULTRA SMALL FLAT-LEAD LOW OUTPUT CAPACITANCE 1-CH OPTICAL COUPLED MOSFET
|
NEC, Corp.
NEC Corp.
NEC[NEC]
|
| 87891-2817 0878912817 |
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50渭m (100渭 Tape on Reel Packaging, Lead-free
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50μm (100μ Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87891-1818 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38渭m (15渭) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87891-2818 0878912818 |
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0526100675 0526101675 0526101275 0526101475 |
1.0 FPC CONN ZIF FOR SMT (ST)WITH TAPE -LEAD FREE-
1.0 FPC CONN ZIF FOR SMT (ST)WITH TAPE -LEAD FREE-
|
Molex Electronics Ltd.
|
| PT510 PT501 PT510A PT501C PT510C PT501A PT501B |
PHOTOTRANSISTOR | NPN | 800NM PEAK WAVELENGTH | CAN-4.7 光电晶体管|叩| 800NM峰值波长|的CAN - 4.7
55V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU2405 with Lead Free Packaging
150V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRFSL33N15D with Lead Free Packaging
such as active OR'ing. Shipped in Tape and Reel only. Part is not available in bulk, TR is implied in part number.; A IRF6610 with Standard Tape and Reel
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF2805S with Standard Packaging
TO-18 Type Narrow Acceptance Phototransistor
|
Sharp Electrionic Components
|
| 0565790576 |
USB On-The-Go (OTG) Mini-AB Receptacle, Right Angle, SMT Solder Tails and ShellTabs, with Cover Tape, Lead-Free
USB On-The-Go (OTG) Mini-AB Receptacle, Right Angle, SMT Solder Tails and ShellTabs, with Cover Tape, Lead-Free
|
Molex Electronics Ltd.
|
| AM29F800BT-90WBC AM29F800BT-55WBI AM29F800BB-55WBE |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3087 with bag packaging
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709Z with Lead Free Packaging
40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7470 with Lead Free Packaging
Complete VR11.0 or AMD PVID power solution.; A IR3505M packaged on tape and reel 3000 per reel
8 PWM 400 KHz Sync Contr in a 8-Pin SOIC(NB) package; A IRU3037ACS with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRLZ44NS with Lead Free Packaging
The XPHASE Control IC combined with an IR XPhase TM Phase IC provides a full featured and flexible way to implement a complete an Opteron or Athlon 64 power solution.; A IR3082M with Tape and Reel Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRLL024Z with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; A IRLL2705 with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-262 Package; Similar to IRF2807ZL with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3805S with Lead Free Packaging
x8/x16 Flash EEPROM x8/x16闪存EEPROM
XPHASE VRD10 Control IC with VccVid and Overtemp Detect; Similar to IR3080M with Lead Free Packaging on Tape and Reel x8/x16闪存EEPROM
XPHASE IC with Fault and Overtemp Detect; Same as the IR3088AM with Tape and Reel Packaging. x8/x16闪存EEPROM
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO44
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO44
|
Linear Technology, Corp.
ATM Electronic, Corp.
Integrated Device Technology, Inc.
Advanced Micro Devices, Inc.
|
| 0534260790 53426-0790 |
2.50mm (.098) Pitch Mini-Lock?/a> Wire-to-Board Header, Right Angle, Friction and Positive Lock, Radial Tape Packaging, 7 Circuits, Lead-free
2.50mm (.098") Pitch Mini-Lock垄芒 Wire-to-Board Header, Right Angle, Friction and Positive Lock, Radial Tape Packaging, 7 Circuits, Lead-free
|
Molex Electronics Ltd.
|
| 53426-0490 0534260490 |
2.50mm (.098) Pitch Mini-Lock?/a> Wire-to-Board Header, Right Angle, Friction andPositive Lock, Radial Tape Packaging, 4 Circuits, Lead-free
2.50mm (.098) Pitch Mini-Lock Wire-to-Board Header, Right Angle, Friction andPositive Lock, Radial Tape Packaging, 4 Circuits, Lead-free
|
Molex Electronics Ltd.
|
| 0878980456 87898-0456 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 4 Circuits, Tin (Sn) Overall Plating, Embossed Tape on Reel Packaging, with Cap, Lead-free
MOLEX Connector
|
Molex Electronics Ltd.
|
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