| PART |
Description |
Maker |
| BCM7020 BCM7020R |
HIGH DEFINITION VIDEO UMA SUBSYSTEM WITH 2D GRAPHICS
|
Broadcom Corporation.
|
| BS616LV2018TI BS616LV2018 BS616LV2018AC BS616LV201 |
Very Low Power/Voltage CMOS SRAM 128K X 16 bit
LM4946 Output Capacitor-Less Audio Subsystem with Programmable National 3D; Package: LLP; No of Pins: 24
LM4946 Output Capacitor-Less Audio Subsystem with Programmable National 3D; Package: MICRO SMD; No of Pins: 25
LM4947 Mono Class D and Stereo Audio Sub-System with OCL Headphone Amplifier and National 3D
|
Brilliance Semiconducto...
BSI[Brilliance Semiconductor]
BRILLIANCE SEMICONDUCTOR, INC.
|
| 7005 7006 ACT7005 ACT7006 |
ACT7005/7006 Single Package Solution Dual Transceiver, Protocol, Subsystem
ACT7005/7006 Single Package Solution Dual Transceiver, Protocol, Subsystem
ACT7005/7006 Single Package Solution Dual Transceiver/ Protocol/ Subsystem
|
Aeroflex Inc.
Aeroflex Circuit Technology
|
| S1T8527C S1T8527C01-Q0R0 |
1 CHIP CLP SUBSYSTEM IC
|
Samsung Electronic
SAMSUNG[Samsung semiconductor]
|
| KB8527 KB8527BQ |
1 CHIP CLP SUBSYSTEM IC
|
Samsung Electronic
|
| HA1199P |
AM SUBSYSTEM FOR CAR RADIO
|
Hitachi Semiconductor
Motorola, Inc
|
| DA9034 |
Audio and Power Subsystem
|
Dialog
|
| MAX9877 |
Mono Audio Subsystem
|
Maxim Integrated Products
|
| AD9864 AD9864-EB |
IF Digitizing Subsystem 中频数字化子系统
|
Analog Devices, Inc.
|
| AD6140 |
Bandpass ∑△ IF Subsystem(带通∑△IF子系
|
Analog Devices, Inc.
|
| LTM9001-AX LTM9001-BX LTM9001CV-BA LTM9001CV-BAPBF |
16-Bit IF/Baseband Receiver Subsystem
|
Linear Technology
|
| PACE1757M P1757M-20PGM P1757M-20QLM P1757M-30PGM P |
COMPLETE EMBEDDED CPU SUBSYSTEM
|
Pyramid Semiconductor Corporation
|
