| PART |
Description |
Maker |
| MPX2301DT1 MPX2300DT1 |
MPX2300DT1 Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications
High Volume Pressure Sensor For Disposable Applications
|
Motorola
|
| MPX2300DT1 |
(MPX2300DT1 / MPX2301DT1) High Volume Pressure Sensor
|
Freescale Semiconductor
|
| IRFK6J054 IRFK6H054 |
350 A, 60 V, 0.003 ohm, 6 CHANNEL, N-CHANNEL, Si, POWER, MOSFET, TO-240AA
ISOLATED BASE POWER HEX-PAK ASSEMBLY PARALLEL CHIP
Lsolated Base Power HEX-pak Assembly Half Bridge Configuration
60V SINGLE HEXFET Power MOSFET in a TO-240AA package
|
IRF[International Rectifier]
|
| MBR0530-M MBR0540-M |
Chip Schottky Barrier Diodes - Silicon epitaxial planer type
MOSFET N-CH 500V 8A D2-PAK
|
美丽微半导体有限公司
缇?附寰??瀵间???????
|
| ZXT1053AKTC ZXT1053AK |
75V NPN LOW SATURATION MEDIUM POWER TRANSISTOR IN D-PAK 75V的npn型低饱和中功率晶体管的D - Pak
NPN Transistors in DPAK
|
Zetex Semiconductor PLC
Diodes Incorporated
Zetex Semiconductors
|
| MBRF12045 MBRF12045R MBRF120100R MBRF12080 MBRF120 |
High Power Schottky Rectifiers - Full Pak Devices
|
America Semiconductor
|
| PTQB425080 |
Intelligent Power Switch 1 Channel High Side Driver in a D2-Pak Package
|
International Rectifier Corp.
|
| VFC1206RABT VFC1206RABW VFC1206RBBT VFC1206RCBT VF |
High Precision Flip Chip, Patents Pending (Industrialized Countries)
High Precision Flip Chip Patents Pending (Industrialized Countries)
Discrete High Precision Flip Chip Resistor
High-Flex Round Conductor Flat Cable; Number of Conductors:10; Pitch Spacing:0.05"; Conductor Size AWG:28; No. Strands x Strand Size:19 x 40; Approval Bodies:UR RoHS Compliant: Yes
|
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
| IR3310S |
Intelligent Power Switch 1 Channel High Side Driver in a D2-Pak 5-Lead Package
|
International Rectifier
|
