| PART |
Description |
Maker |
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| SOT-89-3L |
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
|
List of Unclassifed Manufacturers
Electronic Theatre Controls, Inc.
|
| PM2UH1 |
Package Dimensions in mm
|
VISAY[Vishay Siliconix]
|
| TO-251 |
Package Dimensions
|
Fairchild Semiconductor
|
| MLPM-6PIN |
Package Dimensions
|
IRF[International Rectifier]
|
| MELF |
Package Dimensions
|
Galaxy Semi-Conductor H...
|
| DFN1006H4-2 AP02002 DFN0603H3-2 DFN1006-2 DFN1006- |
PACKAGE OUTLINE DIMENSIONS
|
Diodes Incorporated
|
| LLP75-6A06 |
Package Dimensions in mm (Inches)
|
Vishay Siliconix
|
| ULTRATHIN-5PIN |
Package Dimensions 封装尺寸
|
International Rectifier, Corp.
IRF[International Rectifier]
|
| 369A-13 |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| 528-45AB |
Heat Sink; Package/Case:Half Brick; Body Material:Aluminum; Thermal Resistance:3.2 C/W; Color:Black; Size/Dimensions:0.450H x 2.240W x 2.280L"
|
Wakefield Thermal Solutions
|
