PART |
Description |
Maker |
NHD-C12832A1Z-FSW-FBW-3V3 |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
NHD-C12864HZ-FN-FBW |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
NHD-C12832A1Z-FS-FBW-3V |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display Intern...
|
NHD-C0220BIZ-FS-FBW-3VM |
COG (Chip-On-Glass) Character Liquid Crystal Display Module
|
Newhaven Display Intern...
|
1602F HDG1602F |
Chip On Glass technology
|
List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
|
NHD-C0216CZ-NSW-BBW-3V3 |
COG (Chip-on-Glass) Liquid Crystal Display Module
|
Newhaven Display Intern...
|
THM322020S-10 THM322020S-80 THM322020SG-10 THM3220 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines 2097152 WORDS x 32 BIT DYNAMIC RAM MODULE 2,097,152 WORDS x 32 BIT DYNAMIC RAM MODULE 2/097/152 WORDS x 32 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation TOSHIBA[Toshiba Semiconductor]
|
SIGC81T60SNC |
IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient
|
Infineon Technologies AG
|
5962R9582501QEC 5962R9582501QXC 5962R9582501VEC 59 |
Radiation Hardened 3-Line to 8-Line Decoder/Demultiplexer 辐射加固3线至8线译码器/解复用器 150 PF 5% 50V NPO/COG (0805) CHIP CAP TR From old datasheet system
|
Intersil, Corp. INTERSIL[Intersil Corporation]
|
BC10-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
HRC9-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
S16XXXH S16100NH S1610NH S1616MH S1616NH S16200NH |
The S16xxxH series of SCRs uses a high performance MESA GLASS PNPN technology. 在可控硅S16xxxH系列采用高性能的梅萨玻璃PNPN技术
|
STMicroelectronics N.V. 意法半导 STMICROELECTRONICS[STMicroelectronics]
|