| PART |
Description |
Maker |
| 16190 16190-8 |
THERMAL INTERFACE PAD (MINI)
THERMAL INTERFACE PAD, (MINI)
|
VICOR[Vicor Corporation]
|
| H48-6G |
Thermal Conductive Pad
|
List of Unclassifed Manufacturers
|
| H48-2 |
Thermal Conductive Pad
|
List of Unclassifed Manufacturers
|
| AND8044D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ON Semiconductor
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| KF2004-GM50 KF2004-GM50A |
Thermal Printheads > For BARCODE, SCALE > KF2002*-, 300*-GM Series
Thick film thermal printhead (with thermal historical control) 厚膜热敏打印头（热历史与控制
|
ROHM[Rohm]
Rohm CO.,LTD.
Rohm Co., Ltd.
|
| P2NQ |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| G751-2 G751-1 G751 |
Digital Temperature Sensor and Thermal Watchdog with Two-Wire Interface
|
Global Mixed-mode Technology
Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
|
| ZTACV-MX ZTTCV-MX |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| ADT7490ARQZ-REEL7 |
dBCool Remote Thermal Monitor and Fan Controller with PECI Interface
|
ANALOG DEVICES INC
|
| AD5405YCPZ-REEL7 |
Dual 12-Bit , High Bandwidth, Multiplying DAC with 4 Quadrant Resistors and Parallel Interface; Package: LFCSP (6x6mm w.4.1mm pad); No of Pins: 40; Temperature Range: Industrial
|
ANALOG DEVICES INC
|
