| PART |
Description |
Maker |
| 19459 19459-3 |
THERMAL INTERFACE PAD (VI-200)
THERMAL INTERFACE PAD, (VI-200)
|
VICOR[Vicor Corporation]
|
| 16192 16192-7 |
THERMAL INTERFACE PAD, (MICRO) 热接口垫，（微）
THERMAL INTERFACE PAD (MICRO)
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| AND8044 AND8044_D AND8044/D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ONSEMI
ON Semiconductor
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| EMW42T EMW42T33-409.60-2.5-30 VEMW42T33-409.60-2.5 |
TCXO, CLOCK, 200.01 MHz, HCMOS OUTPUT
HCMOS 4 pad SMD, W Group
|
EUROQUARTZ LTD
EUROQUARTZ limited
|
| TC77-5.0MO TC77 TC77-3.3MC TC77-5.0MOA TC773.3MCTT |
Thermal Sensor with SPI Interface
|
MICROCHIP[Microchip Technology]
|
| LP0002 |
Thermal interface phase change material
|
List of Unclassifed Manufacturers
|
| LP0001 |
Thermal interface phase change material
|
List of Unclassifed Manufacturers
|
| TD1-2D00-031 |
Thermal Dispersion Flow/Level/Interface Switch
|
Magnetrol International, Inc.
|
| TC77-3.3MOA TC773.3MCTTR TC773.3MOA TC77-3.3MCTTR |
Thermal Sensor with SPI Interface 热传感器，SPI接口
|
http://
Epson (China) Co., Ltd.
Microchip Technology Inc.
|
| AD5405YCPZ-REEL7 |
Dual 12-Bit , High Bandwidth, Multiplying DAC with 4 Quadrant Resistors and Parallel Interface; Package: LFCSP (6x6mm w.4.1mm pad); No of Pins: 40; Temperature Range: Industrial
|
ANALOG DEVICES INC
|
| NE2004VA10A A5800562 NE2004-VA10A |
Near edge thin film thermal printhead (8 dots / mm)
From old datasheet system
Near edge thin film thermal printhead (8 dot/mm)
Thermal Printheads > Fro Plastic Card > NE200*-, 300*-VA@ Series
|
Rohm CO.,LTD.
ROHM[Rohm]
|
